Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn–3.5Ag–xTi active solders

Wang, Weilin; Tsai, Yi-Chia

doi:10.1016/j.matchar.2012.03.007

Cited by 30 publications

(10 citation statements)

References 9 publications

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“…Commercial anticorrosion coatings for Al alloys include electroplating [6], chemical conversion coating [7,8], and anodizing coatings [9,10]. Among them, anodizing coatings have the most widespread industrial application because of their ease of processing and low cost [11,12,13,14,15]. The quality of an anodizing coating, including thickness, uniformity, and compactness, is greatly influenced by both the anodizing parameters and the microstructure of the substrate alloy [16].…”

Section: Introductionmentioning

confidence: 99%

Promoted Anodizing Reaction and Enhanced Coating Performance of Al–11Si Alloy: The Role of an Equal-Channel-Angular-Pressed Substrate

et al. 2019

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In this paper, the effect of the equal-channel-angular-pressed (ECAPed) substrate on the coating formation and anticorrosion performance of the anodized Al–11Si alloy was systematically investigated. The ECAP process dramatically refines both Al and Si phases of the alloy. The parallel anodizing circuit is designed to enable a comparative study of anodizing process between the cast and the ECAPed alloys by tracking their respective anodizing current quota. The optimum coatings of both alloys were obtained after anodization for 30 min. The ECAPed alloy attained a thicker, more compact, and more uniform coating. Energetic crystal defects in the fine Al grains of the ECAPed substrate promote the anodizing reaction and lead to the thicker coating. Fragmented and uniformly distributed fine Si particles in the ECAPed alloy effectively suppress the coating cracks, enhancing the compactness of the coating. Overall, the ECAP-coated sample exhibits the best anticorrosion performance, which is evidenced by the concurrently enhanced prevention of coating and improved corrosion resistance of the substrate.

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Section: Introductionmentioning

confidence: 99%

Promoted Anodizing Reaction and Enhanced Coating Performance of Al–11Si Alloy: The Role of an Equal-Channel-Angular-Pressed Substrate

et al. 2019

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“…The task of reducing the weight of vehicles and aircraft through the use of lighter materials is caused by the desire to save fuel, economic benefits, and the environmental agenda [4]. In the automotive industry, aluminum alloys are used as radiator materials for heat dissipation devices, cylinder blocks, car body cladding, and so on [5][6][7]. In the aerospace industry, aluminum alloys of the 2XXX and 7XXX series are mainly used in the manufacture of aircraft frames, spars, and load-bearing elements [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Development of Rapidly-Quenched Al-Ge-Si Filler Alloys for the Joining of Stainless Steel AISI 304 and Aluminum Alloy AA6082

Ivannikov

Fedorov

Abramov

et al. 2021

Metals

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Aluminum alloys based on the Al-Ge-Si system with a germanium content of up to 40 wt.%, promising for the brazing of aluminum alloy AA6082 with the stainless steel AISI 304, were studied. The temperature characteristics and microstructural and mechanical properties of the filler alloys were systematically investigated. Differential scanning calorimetry showed that with an increase in the germanium content from 28.0 to 40.0 wt.%, the liquidus temperature of the filler alloys decreased from 514.8 to 474.3 °C. X-ray diffraction analysis and electron microscopy data showed that the foil of the filler alloys reveals a homogeneous structure. The ingots of the alloys contain two eutectics, the first of which consists of a solid solution of (Al, Ge) with a solid solution of (Ge, Si), and the second consists of a solid solution of (Al, Ge) with a solid solution based on (Ge). When the content of germanium increases from 28.0 to 40.0 wt.%, a separation of the faceted solid solution particles (Ge, Si) and an increase in their number could be observed. Nanohardness measurements showed that the (Ge, Si) and (Ge) solid solutions had similar nanohardness, with values of 11.6 and 10.2 GPa, respectively. Simultaneously, the Al solid solution and the intermetallic Al7Ge2Fe phase exhibited significantly lower nanohardness values of 0.7 and 6.7 GPa, respectively. Brinell hardness measurements showed that the ingots of the filler alloys were sufficiently ductile and had a hardness comparable to that of AA6082, which is used for brazing with AISI 304 stainless steel. The obtained results for the studied ingots and the rapidly quenched foils can be used to predict the forming structure of the seam after brazing and adjusted for diffusion processes occurring between the brazed materials and the studied filler alloys.

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“…The term “active solders” is used for those solders containing one or more elements with a higher affinity to certain elements contained in the chemical composition of the substrate (Xian, 1994; Koleňák and Prach, 2014). Ti and lanthanides (Wang and Tsai, 2012; Tsao, 2014) are normally considered for the active elements.…”

Section: Introductionmentioning

confidence: 99%

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Koleňák

Kostolný

Drápala³

et al. 2019

SSMT

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Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials. Findings X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa. Originality/value The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

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Microstructural characterization and mechanical property of active soldering anodized 6061 Al alloy using Sn–3.5Ag–xTi active solders

Cited by 30 publications

References 9 publications

Promoted Anodizing Reaction and Enhanced Coating Performance of Al–11Si Alloy: The Role of an Equal-Channel-Angular-Pressed Substrate

Promoted Anodizing Reaction and Enhanced Coating Performance of Al–11Si Alloy: The Role of an Equal-Channel-Angular-Pressed Substrate

Development of Rapidly-Quenched Al-Ge-Si Filler Alloys for the Joining of Stainless Steel AISI 304 and Aluminum Alloy AA6082

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

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