Microstructural design of new high conductivity – high strength Cu-based alloy

Gorsse, Stéphane; Ouvrard, Blanche; Gouné, Mohamed; Poulon-Quintin, Angéline

doi:10.1016/j.jallcom.2015.01.234

Cited by 72 publications

(23 citation statements)

References 20 publications

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“…The rapid development of IC technology towards high density, multifunction, miniaturization and low cost, desires the copper alloys having higher performances on the mechanical strength, the electrical conductivity, etc. 1,2 For example, the traditional copper alloys, including Cu-Fe-P, Cu-Ni-Si and Cu-Cr-Zr alloys, are hardly be used in the next generation of very-large-scale integration (VLSI) ICs, which requires a ultimate tensile strength (UTS) over 800 MPa and an electrical conductivity (EC) over 50.0% International Annealed Copper Standard (IACS). [3][4][5] To improve the mechanical and electrical properties of copper alloys, one or more alloying elements, such as Ti, Co, P, Mg, Cr, Zr, Be, and Fe, can be introduced.…”

Section: Intorductionmentioning

confidence: 99%

“…2,26 The main role of trace Zn and Sn elements is to increase the energy of the stacking faults of the matrix, which improves the UTS, but has a negative influence on the EC. 1 The main role of trace Mg and P elements is to purify the melt and increase the fluidity of the melt during melting and casting. 32,35 It is also shown that the addition of P can promote the precipitation of the strengthening phases and Cr particles, 34,35 and thus can enhance the strengthening effect of Ni, Si, and Cr.…”

Section: Construction and Application Of A Property-oriented Mldsmentioning

confidence: 99%

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A property-oriented design strategy for high performance copper alloys via machine learning

et al. 2019

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Traditional strategies for designing new materials with targeted property including methods such as trial and error, and experiences of domain experts, are time and cost consuming. In the present study, we propose a machine learning design system involving three features of machine learning modeling, compositional design and property prediction, which can accelerate the discovery of new materials. We demonstrate better efficiency of on a rapid compositional design of high-performance copper alloys with a targeted ultimate tensile strength of 600-950 MPa and an electrical conductivity of 50.0% international annealed copper standard. There exists a good consistency between the predicted and measured values for three alloys from literatures and two newly made alloys with designed compositions. Our results provide a new recipe to realize the property-oriented compositional design for highperformance complex alloys via machine learning.

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Section: Intorductionmentioning

confidence: 99%

Section: Construction and Application Of A Property-oriented Mldsmentioning

confidence: 99%

A property-oriented design strategy for high performance copper alloys via machine learning

et al. 2019

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“…Gorsse et al [83] prepared Cu-Mg alloys with different Mg contents (4.1 at.%, 8.1 at.%, 23.1 at.%). It was found that with the increase of Mg content, the strength of the alloy increased and the conductivity decreased, it was attributed to the high density of Cu 2 Mg nanoparticles precipitate ( Figure 14).…”

Section: Cu-7agmentioning

confidence: 99%

“…Color online) Calculated strengthening contributions for the casted Cu-Mg alloys. Cu-4.1Mg is a single-phase fcc-Cu(Mg) solid solution; Cu-8.1Mg is composed of fcc-Cu(Mg) and eutectic aggregates, and Cu-23.1Mg consists of fully eutectic structure[83].…”

mentioning

confidence: 99%

High strength and high conductivity Cu alloys: A review

Yang

Lei

et al. 2020

Sci. China Technol. Sci.

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High strength and high conductivity (HSHC) Cu alloys are widely used in many fields, such as high-speed electric railway contact wires and integrated circuit lead frames. Pure Cu is well known to have excellent electrical conductivity but rather low strength. The main concern of HSHC Cu alloys is how to strengthen the alloy efficiently. However, when the Cu alloys are strengthened by a certain method, their electrical conductivity will inevitably decrease to a certain extent. This review introduces the strengthening methods of HSHC Cu alloys. Then the research progress of some typical HSHC Cu alloys such as Cu-Cr-Zr, Cu-Ni-Si, Cu-Ag, Cu-Mg is reviewed according to different alloy systems. Finally, the development trend of HSHC Cu alloys is forecasted. It is pointed out that precipitation and micro-alloying are effective ways to improve the performance of HSHC Cu alloys. At the same time, the production of HSHC Cu alloys also needs to comply with the large-scale, low-cost development trend of industrialization in the future.

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“…In the last decades, growing attention has been focused on the development of copper-based alloys with high strength and good electrical conductivity [1]. In recent times, there have been appearing more and more works investigating the structures and properties of conductive materials based on the Cu-Mg alloys strengthened by different SPD-methods [1 -3].…”

Section: Introductionmentioning

confidence: 99%

Cu / Mg-composites: processing, structure and properties

2019

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The copper-based alloys with high strength and low electrical resistivity are of interest for many practical applications. In this study, Cu / Mg-composites with 1, 7 and 49 magnesium filaments in Cu-matrix have been obtained by hyrdoextrusion at room temperature. The structure, mechanical and electrical properties of the composite rods and thin wires in the deformed and annealed states have been investigated. The strength of the deformed Cu / Mg-composite with a minimal volume fraction of magnesium was found to be abnormally high. The increase of magnesium microhardness was revealed to be near the interface. A change in the lattice constant of the Cu-matrix in the deformed Cu / Mg-composites is discovered by the XRD-method. It has been concluded that, under severe plastic deformation, different solid solutions form on the Cu / Mg-interfaces due to mechanical alloying processes. The Cu / Mg-composite with a maximal volume fraction of Mg has the lowest strength in the deformed state, however, it becomes the strongest one after annealing at 200°C due to annealing hardening of magnesium. The temperature dependences of the electrical resistivity of Cu / Mg-composites differ significantly from each other. During heating, three eutectic transformations are realized in the composite with 7 Mg-filaments. As a result, the electrical resistivity of the deformed Cu / 7Mg-composite increases almost two times. The specific electrical resistivity of the composite with 49 Mg-filaments is a bit different from the electrical resistivity of deformed copper. The mechanisms of structure formation during the heating of these composites have been shown to be significantly different. The obtained results can be used for the development of high-strength Cu-based conductors.

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Microstructural design of new high conductivity – high strength Cu-based alloy

Cited by 72 publications

References 20 publications

A property-oriented design strategy for high performance copper alloys via machine learning

A property-oriented design strategy for high performance copper alloys via machine learning

High strength and high conductivity Cu alloys: A review

Cu / Mg-composites: processing, structure and properties

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