Microstructural evolution and properties of Cu–20 wt% Ag alloy wire by multi-pass continuous drawing

Abstract

The Cu–20 wt% Ag alloy wire rod was prepared using three-chamber vacuum cold mold vertical continuous up-casting followed by multi-pass continuous drawing. The evolution of microstructure, mechanical property, and electrical property of the Cu–20 wt% Ag alloy wire during multi-pass continuous drawing was studied. After multi-pass continuous drawing, the continuous network eutectic structure in the longitudinal section of the as-casted rod was gradually drawn into long fibers that approximately parallel to the axial direction, while the space of the continuous network eutectic structure in the transverse section is getting smaller and smaller. Both the preferred orientation of copper and silver grains are (1,1,1). With the increase of drawing strain (η), the tensile strength of Cu–20 wt% Ag alloy wire gradually increases while the elongation gradually decreases. When the diameter is drawn to 0.02 mm (η = 11.94), the tensile strength of the alloy is 1,682 MPa and elongation is 2.0%. The relationship between tensile strength, elongation, and diameter conforms to Allometric and Boltzmann functions, respectively.

Effects of Ti2SnC MAX Phase on Microstructure, Mechanical, Electrical, and Wear Properties of Stir‐Extruded Copper Matrix Composite

“…The formation of solid solution at the interface of Cu–Ti 2 SnC can affect the strength of the composites through the solid‐solution strengthening mechanism. There are many strengthening mechanisms in CMCs, such as grain refinement (GR), [ 33 ] Orowan strengthening (OS), [ 34,35 ] load transfer (LT), [ 36 ] and thermal mismatch (TM). [ 37,38 ] Due to the different thermal expansion coefficients of the reinforcing phase and copper matrix (as reported in Table 3 ), thermal mismatch strengthening occurs in the cooling step of the composite.…”

“…[39] The mismatch of the thermal expansion and modulus of elasticity coefficients between the copper matrix and reinforcement particles creates dislocations in the matrix, which leads to the strengthening of metal matrix composites. [33] The roomtemperature thermal expansion and elastic modulus coefficients of copper matrix and Ti 2 SnC particles are presented in Table 3, which shows a big difference in their properties, especially in the elastic modulus. This significant difference in the thermal expansion and elastic modulus coefficients may cause geometrically necessary dislocations (GND).…”

Characterization of CuAg Alloys with Low Ag Concentrations

“…In these alloys, heat treatments and their effect on the microstructures become crucial for their final characterization. Mechanical strength, while being scarcely affected by aging, depends strongly on work-hardening processes, such as cold drawing, which allows the alloy to obtain additional hardening through the realization of filamentary structures [12,13]. The conductivity, on the other hand, is reduced overall by the increase of Ag in the solid solution.…”

Processing and Properties of Single-Crystal Copper Wire

“…It was concluded that when the diameter was stretched to 0.02 mm (η = 11.94), the tensile strength of the alloy was 1682 MPa and elongation was 2.0%. The relationship between the tensile strength, elongation, and diameter conformed to Allometric and Boltzmann functions, respectively [15]. Cao studied the performance and microstructure changes in Ag-4Pd alloy wire during heat treatment and determined the best heat treatment temperature for achieving excellent wire performance [16].…”