Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Yakymovych, A.; Plevachuk, Yu.; Sklyarchuk, V.; Sokoliuk, B.; Tsermaa, G.

doi:10.1007/s11669-017-0532-0

Cited by 15 publications

(9 citation statements)

References 24 publications

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“…The transport properties of the liquid SAC305 alloys with Ni nanoparticles were investigated in Refs. [20,21]. The present research acts as a follow-up to these studies, focusing on structural investigations in liquid and after-reflow solid states.…”

Section: Introductionmentioning

confidence: 94%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

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The Sn-Ag-Cu (SAC) alloy family is commonly used in lead-free solders employed in the electronics industry, for instance, SAC305, SAC387, SAC405, etc. However, the trend in manufacturing small electronic products and device miniaturization faces some disadvantages in terms of mechanical properties and their higher melting temperatures compared to Pb-Sn solders, prompting new research relating to the reinforcement of existing SAC solders. The current study presents structural features of nanocomposite (Sn-3.0Ag-0.5Cu)100−x(nanoNi)x solders with 0.5 wt.%, 1.0 wt.%, and 2.0 wt.% Ni. Structural analysis of the investigated samples were performed by means of X-ray diffraction in a liquid state and scanning electron microscopy (SEM). SEM showed the mutual substitution of Ni and Cu atoms in the Cu6Sn5 and Ni3Sn4 phases, respectively. The performed structural studies in liquid and solid states provided essential information concerning the structural transformations of liquid Sn-3.0Ag-0.5Cu alloys caused by minor additions of nanosized Ni powder. The melting point and degree of undercooling of the samples were investigated by DTA analysis.

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Section: Introductionmentioning

confidence: 94%

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Yakymovych

Shtablavyi

2023

Metals

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“…However, Al 2 O 3 nanoparticles did not participate in phase formation but acted as a grain refiner. Yakymovych et al (2017) added Ni nanoparticles into SAC using a cold-pressing method in which powders of SAC and Ni nanopowders were mixed mechanically, and processed into 8 mm diameter rods. It was observed that the presence of Ni nanoparticles in SAC formed a (Cu, Ni) 6 Sn 5 phase which participated in the refinement of the microstructure due to the fine distribution of IMCs in the Sn matrix.…”

Section: Microstructurementioning

confidence: 99%

“…Ag 3 Sn and Cu 6 Sn 5 , which stopped the growth of grains/IMCs during aging/reflowing. However, Al 2 O 3 nanoparticles did not participate in phase formation but acted as a grain refiner (Yakymovych et al, 2017). added Ni nanoparticles into SAC using a cold-pressing method in which powders of SAC and Ni nanopowders were mixed mechanically, and processed into 8 mm diameter rods.…”

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confidence: 99%

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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“…The reinforcement of solder is proven to enhance the quality of solder mechanically, thermally and its wetting properties depending on the reinforced materials. Research on the nano-reinforced solder became more vigorous as researchers found out that adding nanoparticles such as cobalt [1], copper [9][10][11], silver [12], nickel [13][14][15], diamond [3], the molecule of iron nickel oxide [16], iron oxide [17], titanium dioxide [18], zinc oxide [19] and others to the solder proven to increase the solder properties in terms of either one, mechanical, thermal, wetting and intermetallic compound layer or all of them. Researchers have also added rare earth elements such as Erbium (Er) [20], Cerium (Ce), and Lanthanum (La) [21], into the SAC solder.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Nano-Reinforced Lead-Free Solder During Reflow Soldering-A Molecular Dynamic Approach

Sahrudin

Abdullah

Aziz

et al. 2020

CFDL

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The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in the result of the importance solder properties which includes wetting properties and mechanical properties. This study proposed the new simulation method for the nano-reinforced solder to investigate the complexity and atomic behaviour briefly. The objective of this study is to clearly show the movement of the reinforced nanoparticles in the solder during the reflow soldering process via molecular dynamics (MD) simulation. In this work, Nickel (Ni) nanoparticles will be added into the pure Tin (Sn) lead-free solder. The MD simulation of Ni-reinforced solder at the temperature of 250 OC (reflow phase) was conducted via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. This simulation model able to track the nanoparticles movement in the solder during the reflow soldering process. The experimental procedure of 0.01 wt.% Ni nanoparticle reinforcement in Sn100C was also carried out to validate the simulation result. The synchrotron micro-XRF mapping showed the Ni element was agglomerated and thus validated the simulation result. The measured area of agglomerated Ni A in the simulation and experimental results are 1.1708 Å2 and 0.9996 Å2, respectively. Meanwhile, the result obtained for area B is 0.7696 Å2 and 0.6796 Å2, respectively. Therefore, the percentage error of simulation and experimental results for both areas of A and B is 10.82% and 13.24%, respectively.

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Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range

Cited by 15 publications

References 24 publications

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Investigation of Nano-Reinforced Lead-Free Solder During Reflow Soldering-A Molecular Dynamic Approach

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