Microstructure and failure mode of Sn–37Pb soldered in laser diode packages

Interfacial reactions in Au/Sn/Cu sandwich specimens

“…Interfacial reactions affect significantly the reliability of electronic joints [3][4][5][6][7][8][9][10]. The interfacial reactions in the Au/Sn/Cu structure have been examined by Chang et al [5], and Sn is considered as the solder material, which is thicker than Au and Cu and is not exhausted during reaction.…”