2010
DOI: 10.1016/j.msea.2010.09.070
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Microstructure and high tensile strength of Mg–10Gd–2Y–0.5Zr alloy by solid-state recycling

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Cited by 21 publications
(9 citation statements)
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“…A great majority of studies on this topic have focussed on recycling machining swarf into cylindrical bars [3][4][5][6][7][8][9][10][11][12] or rectangular bars [13][14][15], using hot/warm forward extrusion. In addition, recycling processes based on other SPD methods such as cyclic extrusion compression (CEC) [16], equal channel angular pressing (ECAP) [17][18][19], high-pressure torsion (HPT) [20] or compressive torsion [21], and combined use of forward extrusion and ECAP [22,23] have also been reported.…”
Section: Introductionmentioning
confidence: 99%
“…A great majority of studies on this topic have focussed on recycling machining swarf into cylindrical bars [3][4][5][6][7][8][9][10][11][12] or rectangular bars [13][14][15], using hot/warm forward extrusion. In addition, recycling processes based on other SPD methods such as cyclic extrusion compression (CEC) [16], equal channel angular pressing (ECAP) [17][18][19], high-pressure torsion (HPT) [20] or compressive torsion [21], and combined use of forward extrusion and ECAP [22,23] have also been reported.…”
Section: Introductionmentioning
confidence: 99%
“…A high temperature helps to increase plastic behavior of the material and finally enhances deformation. On top of that, it promotes particle precipitation and a higher diffusion rate which enables excellent interfacial bonding between chips that in turn reduces voids as well [12][13][14]. The pressure parameter also contributes to better chips consolidation [15].…”
Section: Analysis Of Variance Resultsmentioning
confidence: 99%
“…High amount of heat helps to increase the plasticity of the material which subsequently enhanced the consolidation. Added to this, it promotes particle precipitation and higher diffusion rate which realizes excellent interfacial bonding among chips that in turn reduces voids as well [34,38,58]. The pressure also contributes to better chip consolidation [23].…”
Section: Analysis Of Anova Resultsmentioning
confidence: 99%
“…ET c (300) [69] ET(350) [51,62,69] ET(300-500) [38] ET(400) [58,62,[69][70][71][72] ET(450) [10,11,14,20,37,40,41,61] ET(500) [8,22,23,34,64] ET(520) [63] ET(550) [7,11,22] ECAPT d (300-350) [38] ECAPT(450) [26] FT e (430, 460, 490 & 520) [55] C: Compaction Force 400 kN [61] 25 MPa [47] 625 MPa [25] 400 MPa [63,64] 500 kN [10] 650 & 700 MPa [23] 210 MPa [8,22,34] 60 kN [14,20,37] 303 MPa [12] 200 & 360 MPa [24] D: Extrusion Ratio Graphite [22] Aluminium bronze [22] Ferro-chromium …”
Section: Effects Of Chip Morphology Pre-molding and Lubrication Methodsmentioning
confidence: 99%
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