This article provides an intensive review of the past and current research work on the solid-state recycling of light metals. The review includes an experimental aspect of the relevant works that clearly clarify the effects of several critical factors noted as chip preparation, reinforcing phases, die geometry, process parameter selection and performance of miscellaneous methods over the quality of the extruded profiles. Likewise, reviews of numerical and analytical works on the solid-state recycling were presented to understand the strengthening phenomena of chip-based billet through the plastic deformation. Finally, concluding remarks underline challenges of direct recycling method and subsequently highlight the potential future work on making the method as a promising alternative for sustainable manufacturing agenda.
In solid‐state recycling, chip morphology related parameters such as size fraction, surface topography and geometry are important factors in resulting final bond strength. Analyzing deformation parameters together with chip morphology can provide an insight of which factors are very crucial to mechanical performance of the recycled chips. This work investigates the effect of chip morphology and in particular chip roughness and surface area on the weld strength of direct recycled aluminum chips. The influence of these factors were compared with the influences of temperature and pressure. Full factorial design with center point analysis was adopted to rank the factors effects. The chips of AA6061 were cold compacted at 10 tonnes and subsequently hot forged through the dog bone shape‐die at different operating regimes. The elastic and plastic behavior and ultimate tensile strength of the hot‐pressed samples were analyzed and compared. It was found that temperature and pressure are more important to be controlled rather than the chip morphology. Low chip roughness incorporated with high temperature revealed a very significant influence over the weld strength attainment. Regardless of the chip roughness, the bond strength can still be maximized when other deformation factors were controlled within the minimum specified limit.
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