Microstructure characterization of metal interconnects and barrier layers: status and future

Zschech, Ehrenfried; Besser, Paul R.

doi:10.1109/iitc.2000.854334

Cited by 6 publications

(1 citation statement)

References 7 publications

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“…The EM lifetime depends on a variation of material properties at the microscopic and atomistic levels. Microscopic properties are grain boundaries and grains with their crystal orientation [2]. Atomistic properties are configurations of atoms at the grain boundaries, at the interfaces to the surrounding layers, and at the cross-section between grain boundaries and interfaces.…”

Section: Introductionmentioning

confidence: 99%

Microstructural impact on electromigration: A TCAD study

Ceric

Orio²,

Zisser

et al. 2014

FACTA U EE

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Current electromigration models used for simulation and analysis of interconnect reliability lack the appropriate description of metal microstructure and consequently have a very limited predictive capability. Therefore, the main objective of our work was obtaining more sophisticated electromigration models. The problem is addressed through a combination of different levels of atomistic modeling and already available continuum level macroscopic models. A novel method for an ab initio calculation of the effective valence for electromigration is presented and its application on the analysis of EM behavior is demonstrated. Additionally, a simple analytical model for the early electromigration lifetime is obtained. We have shown that its application gives a reasonable estimate for the early electromigration failures including the effect of microstructure.

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Section: Introductionmentioning

confidence: 99%

Microstructural impact on electromigration: A TCAD study

Ceric

Orio²,

Zisser

et al. 2014

FACTA U EE

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Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence

Budiman

2014

Probing Crystal Plasticity at the Nanoscales

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Solvothermal synthesis of group 5 and 6 nitrides via reactions using LiNH2 and ammonia nitrogen sources

2010

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Transition metal chlorides are reacted with lithium amide or ammonia under solvothermal conditions in benzene at temperatures up to 550 degrees C. The products are metal nitrides with particle sizes of a few nm. VN, NbN, CrN, MoN and WN form with a cubic rocksalt-type structure, whilst Ta(3)N(5) adopts the known orthorhombic structure. Products often contain carbon due to solvent decomposition, the carbon content is higher when ammonia is the nitrogen source, and varied to some extent from metal to metal. Analytical data shows nitrogen-deficient carbonitride compositions. Most samples crystallise with partially aggregated, regular crystallites. Some crystallise with a nanorod morphology and this was most pronounced in Ta(3)N(5), which forms high aspect ratio, single crystal nanorods when synthesised with ammonia.

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Microstructure characterization of metal interconnects and barrier layers: status and future

Cited by 6 publications

References 7 publications

Microstructural impact on electromigration: A TCAD study

Microstructural impact on electromigration: A TCAD study

Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence

Solvothermal synthesis of group 5 and 6 nitrides via reactions using LiNH2 and ammonia nitrogen sources

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