Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

“…5). Similar behavior was reported in many previous studies 8,11,12,23 and explained based on the theory of adsorption of a surface-active material. This means that the addition of ceramic nanoparticles increases the content of surface-active material in the solder joint and maximizes the amount of adsorbed particles on the IMC surface.…”

“…5). This fact might be due to formation of a Cu 6 Sn 5 / 23 and in the present study. It should be noted that in these papers no information on the size of the solder joints is given, which could also have an effect on the solder joint characteristics.…”

“…An insignificant decrease of the average thickness of the IMC layer at the interface solder/OSP-Cu was reported by adding 1 wt.% nano ZrO 2 into SAC305 solder powder. 23 In surprising contrast, the same authors showed a continuous decrease of the average thickness of the IMC at the interface up to 3.0 wt.% of nano ZrO 2 using Au/Ni metallized Cu pads. 13 Our experimental results showed that the average total thickness of the IMC layer formed at the Cu/solder/ Cu interfaces using the SAC305 solder paste is higher compared with the literature data (Fig.…”

Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction

“…5 However, Pbfree solders have a very high concentration of Sn (about 95-99.3 wt.%), leading to rapid formation of Cu-Sn IMCs at the interface and compromising reliability. 5 Recent advances in nanoparticle synthesis and processing have led to the possibility of introducing components into the solder in nanoparticle form, [7][8][9][10] thus extending the range of possible solder paste systems and leading to increased interest in solders containing reactive elements. One potential method for improving solder joint reliability is to add chemically reactive elements, such as Al 11 and Zn, [12][13][14] to the solder to modify the IMC and to form in situ barrier layers that prevent continuous IMC growth during service.…”

Suppression of Cu 6 Sn 5 in TiO 2 reinforced solder joints after multiple reflow cycles

“…In a typical Pb-free solder joint, Cu6Sn5, which may form either as primary crystals or an interfacial layer during soldering can play a determining role in solder joint strength. There is evidence that by suppressing the Cu6Sn5 interfacial layer, solder joint properties could be improved [13][14][15][16][17] and as such there are benefits associated with controlling the growth of this layer during multiple reflows.It has recently been reported that additions of reinforcement to a variety of solder matrices, with compounds including silicon carbide (SiC) [18][19][20], nickel oxide (NiO) [21], alumina (Al2O3) [22][23][24], zirconia (ZrO2) [25][26][27][28], titanium oxide (TiO2) [29][30][31][32][33][34] and silicon nitride (Si3N4) [35,36] result in suppression of the growth of the interfacial layer during soldering [37]. In our recent study [38], we developed a method of fabricating a reinforced solder using a powder metallurgy microwave sintering method that results in a homogeneous distribution of TiO2 in the solder material and an improvement in the bulk solder material thermal and mechanical properties.…”