Microstructure of directionally solidified Ti–Fe eutectic alloy with low interstitial and high mechanical strength

Contieri, Rodrigo José; Lopes, Éder Sócrates Najar; Cruz, M. Taquire de la; Costa, Ana Maria Duarte Dias; Afonso, Conrado Ramos Moreira; Caram, Rubens

doi:10.1016/j.jcrysgro.2011.07.007

Cited by 26 publications

(11 citation statements)

References 19 publications

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“…7 The variation of microhardness with temperature gradient at a constant growth rate Table 3 The relationships between the microstructure parameter, solidification parameters, and the mechanical properties The average exponent value (0.17) of k obtained from this study as a function HV is in good agreement with the values of 0.19, 0.21, and 0.20 reported by Böyük and Maraşlı [32] for Sn-3.5Ag-0.9Cu (wt%) eutectic alloy, by Hu et al [26,27] for Sn-58wt%Bi and Sn-1.0wt%Cu eutectic alloys, and by Ç adırlı et al [36] for Pb-61.9wt%Sn eutectic alloy, respectively. But this exponent value is smaller than the values of 0.33 and 0.50 obtained by Contieri et al [6] for Ti-32.5wt%Fe eutectic alloy and by Liu et al [1] for Zn-3.1wt%Mg and Zn-5wt%Al alloys, respectively.…”

Section: The Effect Of Microstructure and Solidification Parameters Ocontrasting

confidence: 57%

“…16 for r UTS is in good agreement with the values of 0.26 and 0.24 obtained by Hu et al [27] for Sn-1.0wt%Cu eutectic alloy and by Ç adırlı et al [36] for Pb-61.9wt%Sn eutectic alloy, respectively. But this exponent value is much smaller than the values of 0.50 and 0.64 obtained by Garcia et al [2] for Sn-9wt%Zn eutectic alloy and by Contieri et al [6] for Ti-32.5wt%Fe eutectic alloy, respectively. One of the reasons for higher discrepancies of the exponent values might be due to the differences between the strain rates.…”

Section: The Effect Of Microstructure and Solidification Parameters Ocontrasting

confidence: 53%

“…The change in the lamellar spacing depends on the different solidification parameters (temperature gradient, growth rate, and cooling rate) plays a vital role in the mechanical properties of the materials. Many studies performed on the improvement of the mechanical properties by finer lamellar structures are reported in the literature [1][2][3][4][5][6][7][8]. Recently, some studies have concentrated on the ternary and multicomponent alloy systems [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

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Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

Çadırlı

Şahin

Turgut

2015

Metallogr. Microstruct. Anal.

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A Sn-40.5wt%Pb-2.6wt%Sb ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified at a constant growth rate (V = 16.5 lm/s) under different temperature gradients (G = 1.05-3.88 K/mm) and at a constant temperature gradient (G = 3.88 K/mm) under different growth rates (V = 8.3-498 lm/s). The effects of G and V on lamellar spacing (k), microhardness (HV), and ultimate tensile strength (r) were determined. The lamellar spacing and microhardness were measured from both longitudinal and transverse sections of the sample. The relationships between solidification parameters (G, V), microstructure parameters (k L , k T ), and mechanical properties (HV, r) were determined from linear regression analysis. It was found that the microhardness and tensile strength increase with increasing G and V as well as with decreasing k.

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Section: The Effect Of Microstructure and Solidification Parameters Ocontrasting

confidence: 57%

Section: The Effect Of Microstructure and Solidification Parameters Ocontrasting

confidence: 53%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

Çadırlı

Şahin

Turgut

2015

Metallogr. Microstruct. Anal.

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“…Some investigators also concluded that the classic JH model is also valid for describing the relationship between eutectic spacing and growth velocity in ternary eutectic systems [9]. On the other hand, the variation of solidification parameters leads to the change in eutectic patterns, which in turn influences their physical properties [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Ternary eutectic growth during directional solidification of Ag–Cu–Sb alloy

Zhai

Wang

et al. 2015

Philosophical Magazine Letters

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2015): Ternary eutectic growth during directional solidification of Ag-Cu-Sb alloy, Philosophical Magazine Letters,The directional solidification process of ternary Ag 42.4 Cu 21.6 Sb 36 eutectic alloy within a wide growth rate range from 2 to 60 μm/s was accomplished at a constant temperature gradient of 50 K/cm. As growth rate increases, the ternary (θ(Cu 2 Sb) + ε(Ag 3 Sb) + Sb) eutectic morphology evolves from "lamellar (θ + ε) plus fibrous (Sb)" structure into "(θ + Sb) fibres in continuous ε matrix" structure. The θ and (Sb) phase spacings decrease with the increase of growth rate according to power functions with exponent values of 0.55 and 0.56, respectively. It is also found that the microhardness of directionally solidified Ag 42.4 Cu 21.6 Sb 36 alloy samples is enhanced with the increase of growth rate, and the decrease of θ and (Sb) phase spacings.

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“…Numerous alloys of commercial importance solidify fully or partly as eutectics [2][3][4][5][6][7][8][9][10]. In addition, the mechanical properties of alloys can be improved by inducing the formation of a finer microstructure under various controlled solidification conditions [11][12][13][14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Mechanical, electrical, and thermal properties of the directionally solidified Bi-Zn-Al ternary eutectic alloy

Şahin

Çadırlı

2014

Int J Miner Metall Mater

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A Bi-2.0Zn-0.2Al (wt%) ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth rate (V = 18.4 μm/s) under different temperature gradients (G = 1.15-3.44 K/mm) and at a constant temperature gradient (G = 2.66 K/mm) under different growth rates (V = 8.3-500 μm/s) in a Bridgman-type directional solidification furnace. The dependence of microstructure parameter (λ) on the solidification parameters (G and V) and that of the microhardness (Hv) on the microstructure and solidification parameters were investigated. The resistivity (ρ) measurements of the studied alloy were performed using the standard four-point-probe method, and the temperature coefficient of resistivity (α) was calculated from the ρ-Τ curve. The enthalpy (ΔH) and the specific heat (C p ) values were determined by differential scanning calorimetry analysis. In addition, the thermal conductivities of samples, obtained using the Wiedemann-Franz and Smith-Palmer equations, were compared with the experimental results. The results revealed that, the thermal conductivity values obtained using the Wiedemann-Franz and Smith-Palmer equations for the Bi-2.0Zn-0.2Al (wt%) alloy are in the range of 5.2-6.5 W/Km and 15.2-16.4 W/Km, respectively.

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Microstructure of directionally solidified Ti–Fe eutectic alloy with low interstitial and high mechanical strength

Cited by 26 publications

References 19 publications

Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

Characterization of a Directionally Solidified Sn–Pb–Sb Ternary Eutectic Alloy

Ternary eutectic growth during directional solidification of Ag–Cu–Sb alloy

Mechanical, electrical, and thermal properties of the directionally solidified Bi-Zn-Al ternary eutectic alloy

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