Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application

Wang, Feng; Xiong, Baiqing; Zhang, Yongan; Zhu, Baohong; Liu, Hongwei; Wei, Yunrong

doi:10.1016/j.matchar.2008.01.012

Cited by 43 publications

(18 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Indeed, it is worth noting that a change in each dimension (length, width and thickness) of the plate has the same effect on the value of the probability of failure and a homothetic transformation is enough to represent any variation of volume. The abacus of probability of failure of a second volume is calculated from the previous one, with the Eq (16).…”

Section: T1 T2mentioning

confidence: 99%

“…Nevertheless, the knowledge of its mechanical properties and their variation with temperature is limited. Few studies [16][17] already present the values of Young's modulus and flexural strength but do not consider the temperature effect on mechanical properties. Moreover, the main feature of the mechanical behaviour of this material is its brittleness.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Probabilistic rupture analysis of a brittle spray deposited Si–Al alloy under thermal gradient: Characterization and thermoelastic sizing guidelines

2016

View full text Add to dashboard Cite

The spray-deposited Si-Al CE9F alloy is a new material used for space applications involving temperature gradient. Thermal stresses arise and may affect the mechanical integrity of the components. It is therefore necessary to assess the critical temperature gradient to avoid failure. Hence this paper deals with the effect of temperature on the mechanical properties of the Si-Al CE9F alloy from-50°C to 130°C: Young's modulus, coefficient of thermal expansion and Weibull's parameters of the material to account for its brittle fracture behaviour through the Weibull's model. The experiments indicate a linear dependence of the Young's modulus with temperature and show that the coefficient of thermal expansion and the Weibull's parameters are almost constant in the temperature range [-50°C, 130°C]. From these results, an example of application schematizing a clamped plate under temperature gradient is studied to create abacus of probability of failure. These abacuses provide sizing guidelines and show the impact of the equivalent volume, highlighting the critical temperature gradients.

show abstract

Section: T1 T2mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Probabilistic rupture analysis of a brittle spray deposited Si–Al alloy under thermal gradient: Characterization and thermoelastic sizing guidelines

2016

View full text Add to dashboard Cite

show abstract

“…Among the numerous environmentally friendly leadfree solders, SnAgCu system solder alloy with its excellent mechanical properties and solder joint quality is of particular interest [1][2][3][4]. Given the complex service conditions of electronic products, research on the fracture and deformation behaviors [3][4][5][6], nanomechanical properties as a function of temperature [5][6][7][8][9][10] have been performed for lead-free solders recently. Further, the aim of the current study is to investigate the strain rate sensitivity of SnAgCu solder using nanoindentation.…”

Section: Introductionmentioning

confidence: 99%

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Xiao

Gao

Jia

et al. 2014

Materials Science and Engineering: A

View full text Add to dashboard Cite

“…[11][12][13][14]. Due to the homogeneous distribution of Si particles in composites, components made from Si p /Al MMCs are nearly isotropic and readily formable [15,16]. Moreover, this material can be customized to meet specific requirements such as different coefficients of thermal expansion and thermal conductivity via changes in the Si content in the composites, making them especially attractive for aerospace engineering and the automotive industry, in addition to their electronic packaging applications [17,18].…”

Section: Introductionmentioning

confidence: 99%

Joining of Silicon Particle-Reinforced Aluminum Matrix Composites to Kovar Alloys Using Active Melt-Spun Ribbons in Vacuum Conditions

Gao

Yang

et al. 2020

Materials

View full text Add to dashboard Cite

The vacuum brazing of dissimilar electronic packaging materials has been investigated. In this research, this applies silicon particle-reinforced aluminum matrix composites (Sip/Al MMCs) to Kovar alloys. Active melt-spun ribbons were employed as brazing filler metals under different joining temperatures and times. The results showed that the maximum joint shear strength of 96.62 MPa was achieved when the joint was made using Al-7.5Si-23.0Cu-2.0Ni-1.0Ti as the brazing filler metal at 580 °C for 30 min. X-ray diffraction (XRD) analysis of the joint indicated that the main phases were composed of Al, Si and intermetallics, including CuAl, TiFeSi, TiNiSi and Al3Ti. When the brazing temperature ranged from 570 °C to 590 °C, the leakage rate of joints remained at 10−8 Pa·m3/s or better. When the joint was made using Al-7.5Si-23.0Cu-2.0Ni-2.5Ti as the brazing filler metal at 580 °C for 30 min, the higher level of Ti content in the brazing filler metal resulted in the formation of a flake-like Ti(AlSi)3 intermetallic phase with an average size of 7 µm at the interface between the brazing seam and Sip/Al MMCs. The joint fracture was generally in the form of quasi-cleavage fracture, which primarily occurred at the interface between the filler metal and the Sip/Al MMCs. The micro-crack propagated not only Ti(AlSi)3, but also the Si particles in the substrate.

show abstract

Microstructure, thermo-physical and mechanical properties of spray-deposited Si–30Al alloy for electronic packaging application

Cited by 43 publications

References 4 publications

Probabilistic rupture analysis of a brittle spray deposited Si–Al alloy under thermal gradient: Characterization and thermoelastic sizing guidelines

Probabilistic rupture analysis of a brittle spray deposited Si–Al alloy under thermal gradient: Characterization and thermoelastic sizing guidelines

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

Joining of Silicon Particle-Reinforced Aluminum Matrix Composites to Kovar Alloys Using Active Melt-Spun Ribbons in Vacuum Conditions

Contact Info

Product

Resources

About