Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication

Lei, Kin Fong; Ahsan, Syed Saad; Budraa, N.; Li, Wen J.; John, D.

doi:10.1016/j.sna.2003.12.018

Cited by 87 publications

(53 citation statements)

References 4 publications

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“…The second bonding process considered was microwave bonding. Microwave bonding is a novel technology for bonding two metallized dielectric or semiconductor wafers to each other (Lei et al, 2004;Yussuf et al, 2005). However, in this study, the bonding results demonstrated that the microwave bonding was not reliable for the present material system and the sample bonded by microwave bonding had weak bond strength.…”

Section: Anodic Bonding Processmentioning

confidence: 68%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and Numerical studies predict that increased constraint and smaller size will accelerate fatigue failure due to changes in plastic deformation. Strain gradients significantly affect the process. Measurements of toughness and fatigue crack growth resistance for the model material system are reported. New test protocols for the commonly used 4 point bend delamination test are developed such that both cracks can be propagated and the number of test data obtained is doubled. The novel approach is also essential for fatigue crack growth. While crack growth resistance was rather independent of the thickness of and fatigue crack growth rates were found to be dependent of film thickness. The dependence of the failure behavior on film thickness arises primarily due to enhanced crack path deflection for decreasing film thickness. Material separation in fracture and fatigue is characterized through a cohesive zone law. The model captures the Paris-law type response obtained in experiments, and also predicts that for thinner films the tendency to crack. Damage tolerant design requires accurate data on residual strength and fatigue crack growth resistance. Both quantities, however, depend on constraint and size of the structure considered. While this has been accounted for in residual strength analysis in the past, the present work provides enabling technologies to solve this problem for fatigue. With the conventional approach to fatigue crack growth, the transferability of data from lab to field, or between specimens and structures is not ensured. Thus, coefficients in the Paris law need to be determined experimentally for each level of constraint or each size of interest. It is, however, not ensured that even a large set of experiments will be able to capture all possible load scenarios. The cohesive zone model approach is provided here as alternative. Once cohesive zone parameters are determined, the dependence of fatigue crack growth on constraint and size emerges as the natural outcome of the analysis without the need to further model modifications. 3

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Section: Anodic Bonding Processmentioning

confidence: 68%

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Siegmund¹

2006

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“…Lei et al [34]. They bonded PMMA to PMMA and Silicon by covering the material with gold as shown in Figure 2-16.…”

Section: Microwave Bondingmentioning

confidence: 99%

Polymer bonding by induction heating for microfluidic applications

Knauf

Webb

Liu

et al. 2010

3rd Electronics System Integration Technology Conference ESTC

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“…In 2004, Lei et al [42] have employed microwave-based technique for the precise, localized, low-temperature bonding of PMMA microdevices. Microwave power can be absorbed by a very thin film metal layer deposited on PMMA surface.…”

Section: Microwave Bondingmentioning

confidence: 99%

Fabrication, modification, and application of poly(methyl methacrylate) microfluidic chips

2008

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Poly(methyl methacrylate) (PMMA) is particularly useful for microfluidic chips with the features of low price, excellent optic transparency, attractive mechanical and chemical properties, ease of fabrication and modification, biocompatibility, etc. During the past decade, significant progress in the PMMA microfluidic chips has occurred. This review, which contains 120 references, summarizes the recent advances and the key strategies in the fabrication, modification, and application of PMMA microfluidic chips. It is expected that PMMA microchips should find a wide range of applications and will lead to the creation of truly disposable microfluidic devices.

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Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication

Cited by 87 publications

References 4 publications

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Numerical Simulation and Experiments of Fatigue Crack Growth in Multi-Layer Structures of MEMS and Microelectronic Devices

Polymer bonding by induction heating for microfluidic applications

Fabrication, modification, and application of poly(methyl methacrylate) microfluidic chips

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