“…This technology has become a popular technology for automobiles and wireless communications due to the advantages of the excellent combination of electrical, thermal, mechanical and chemical stability for a wide range of applications, thus allowing preparation of 3-dimensional circuits incorporating passive components within a multilayer construction (Matters-Kammerer et al, 2006;Zhou et al, 2008). This approach also allows the presence a number of interfaces and thus reduction of the overall substrate size and cost can be realized (Lo and Duh, 2002;Chen et al, 2004 andZhu et al, 2007). The circuits are capable of withstanding sintering during processing temperatures up to 1000 °C.…”