Microwave Flash Sintering of Inkjet‐Printed Silver Tracks on Polymer Substrates

Perelaer, Jolke; Klokkenburg, Mark; Hendriks, Chris E.; Schubert, Ulrich S.

doi:10.1002/adma.200901081

Cited by 212 publications

(174 citation statements)

References 29 publications

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“…In 1966 Storchheim [10] published a US patent, entitled 'Flash sintering', on the rapid densification of a biphasic composite achieved by conventional furnace heating above the melting temperature of at least one of the phases (no current flows across the material), resulting in a 'flash' (in this case meaning very rapid) sintering process. In 2009, FS was referred to as the instantaneous heating/sintering of metal nano-inks in printed electronics using a Xenon lamp [11].…”

Section: Introductionmentioning

confidence: 99%

Review of flash sintering: materials, mechanisms and modelling

Grasso

McKinnon

et al. 2016

Advances in Applied Ceramics

401

248

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Flash sintering (FS) is an energy efficient sintering technique involving electrical Joule heating, which allows very rapid densification (<60 s) of particulate materials. Since the first publication on flash-sintered zirconia (3YSZ) in 2010, it has been intensively researched and applied to a wide range of materials. Going back more than a century ago, we have found a close similarity between FS of oxides and Nernst glowers developed in 1897. This review provides a comprehensive overview of FS and is based on a literature survey consisting of 88 papers and seven patents. It correlates processing parameters (i.e. electric field magnitude, current density, waveforms (AC, DC) and frequency, furnace temperature, electrode materials/ configuration, externally applied pressure and sintering atmosphere) with microstructures and densification mechanisms. Theorised mechanisms driving the rapid densification are substantiated by modelling work, advanced in situ analysis techniques and by established theories applied to electric current assisted/activated sintering techniques. The possibility of applying FS to a wider range of materials and its implementation in industrial scale processes are discussed.

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Section: Introductionmentioning

confidence: 99%

Review of flash sintering: materials, mechanisms and modelling

Grasso

McKinnon

et al. 2016

Advances in Applied Ceramics

401

248

View full text Add to dashboard Cite

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“…The print process conditions were set as follows: the cartridge temperature was 35 °C and the substrate temperature was 45 °C in order to achieve a good sintering of a drop on the substrate. After the printing process the antenna was dried in a vacuum oven at 120 °C for 20 minutes in order to sinter the nanoparticles and create a compact layer [10][11][12][13][14][15][16]. 2.…”

Section: Experimental Methodsmentioning

confidence: 99%

Microstrip antenna from silver nanoparticles printed on a flexible polymer substrate

Matyas

Slobodian

Münster

et al. 2017

Materials Today: Proceedings

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This work describes the use of inkjet printing technology to fabricate a flexible microstrip antenna. The antenna is printed on a flexible PET foil (Polyethylene terephthalate) using silver nanoparticles. Silver nanoparticles were synthetized by the solvothermal precipitation technique. The diameter of the prepared silver nanoparticles ranges from 20 to 200 nm measured with the help of the SEM analysis. In addition, the ink formulation for printing of a homogenous and electrically conductive layer was further prepared using silver nanoparticles. The printed antenna operates in two frequency bands of 2.02 GHz (-16.02 db) and 2.3 GHz (-19.33 db). The antenna is flexible and weigh is only 0.208 g and is suitable for electronic devices of a very low weight, such as wearable electronic devices.

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“…[1][2][3] After inkjet printing, however, a thermal treatment is needed to remove such coatings and to allow for nanoparticle necking, so as to yield patterned metallic films of desired electrical conductivity. [1,3,10,15,16] Except for the case of gold, such thermal treatments in air can result in significant oxidation of the metallic nanoparticles, particularly for relatively inexpensive non-noble metals, such as copper. [1,[17][18][19][20][21][22][23] While inert or reducing gas atmospheres could be used to minimize or avoid such oxidation, processes that avoid such inert gas thermal treatments would be preferred for scalable manufacturing.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4] Reports of inkjet-printed metalized devices on flexible substrates range from antennas to sensors to thin film transistors to RFID tags. [1,[5][6][7][8][9][10][11][12][13][14] The patterned metallization of substrates using inkjet printing is commonly conducted with inks comprised of a dispersion of metallic nanoparticles within a carrier fluid tailored to achieve a desired viscosity and wetting behavior for a particular substrate. [1][2][3][4] Coatings on the metallic nanoparticles are used to ensure that the nanoparticles remain well dispersed in the ink.…”

Section: Introductionmentioning

confidence: 99%

Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

Cook

Fang

Kim

et al. 2013

Electron. Mater. Lett.

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A scalable, low-cost process for fabricating copper-based microwave components on flexible, paper-based substrates is demonstrated. An inkjet printer is used to deposit a catalyst-bearing solution (tailored for such printing) in a desired pattern on commercially-available, recyclable, non-toxic (Teslin ® ) paper. The catalystbearing paper is then immersed in an aqueous copper-bearing solution to allow for electroless deposition of a compact and conformal layer of copper in the inkjet-derived pattern. Meander monopole antennas comprised of such electroless-deposited copper patterns on paper exhibited comparable performance as for antennas synthesized via inkjet printing of a commercially-available silver nanoparticle ink. However, the solutionbased patterning and electroless copper deposition process avoids nozzle-clogging problems and costs associated with noble metal particle-based inks. This process yields compact conductive copper layers without appreciable oxidation and without the need for an elevated temperature, post-deposition thermal treatment commonly required for noble metal particle-based ink processes. This low-cost copper patterning process is readily scalable and may be used to generate a variety of copper-based microwave devices on flexible, paper-based substrates.

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Microwave Flash Sintering of Inkjet‐Printed Silver Tracks on Polymer Substrates

Cited by 212 publications

References 29 publications

Review of flash sintering: materials, mechanisms and modelling

Review of flash sintering: materials, mechanisms and modelling

Microstrip antenna from silver nanoparticles printed on a flexible polymer substrate

Inkjet catalyst printing and electroless copper deposition for low-cost patterned microwave passive devices on paper

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