Microwedge indentation of the thin film fine line—II. Experiment

Boer, Maarten P. de; Gerberich, William W

doi:10.1016/1359-6454(95)00430-0

Cited by 59 publications

(26 citation statements)

References 33 publications

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“…For instance, testing with a special indenter such as the wedge indentation test was proposed to measure adhesion of thin metal lines (see Fig. 19) [73,74],. This method is less sensitive to the measurement accuracy of crack length and it is easier to induce interfacial failure compared to the normal indentation test by conical indenters or pyramids due to its geometry.…”

Section: Some Special Indentation Techniquesmentioning

confidence: 99%

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

124

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The fundamental property which often dictates the performance of a coating is its adhesion to the substrate and thus there are many techniques to measure adhesion. The choice of methods is dependent on many factors such as the mechanical properties of the coating and substrate, the interface properties, the microstructure of the coating/substrate system, residual stress, coating thickness and the intended application. Most tests aim to introduce a stable interfacial crack and make it propagate under controlled conditions and model this process to determine adhesion. The corresponding models are either stress analysis-based or energy-based. With the advent of miniature systems and very thin functional coatings, there is a need for characterization of adhesion at small length scales and some specific tests have been developed which are not appropriate for thicker coatings. Among these, indentation and scratch methods have the widest range of applicability but it is necessary to analyse the failure mechanisms before choosing an appropriate model to extract adhesion parameters. This paper reviews the main quantitative adhesion tests for coatings and highlights the tests which can be used to assess submicrometre coatings and thin films. The paper also highlights the modelling and analysis methods necessary to extract reliable adhesion properties illustrating this with examples for submicrometre coatings on silicon and architectural glass.

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Section: Some Special Indentation Techniquesmentioning

confidence: 99%

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Chen¹,

Bull²

2010

J. Phys. D: Appl. Phys.

124

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“…Based on the Linear Elastic Fracture Mechanics (LEFM) approach, two new adhesion tests, the Microwedge Indentation (MWIT) and the Precracked Line Scratch (PLST) tests, have been proposed and performed on the W/SiO 2 /Si system by Maarten deBoer et al [1][2][3][4]. Both tests are applicable to the thin interconnect lines, and account for thin film geometry.…”

Section: Introductionmentioning

confidence: 99%

“…Both MWIT and PLST models [1][2][3][4] were experimentally verified on the macroscopic scale using polycarbonate as a line material bonded to a steel substrate with cyanoacrylate. New features such as initial crack growth as well as instantaneous crack growth at buckling were observed.…”

Section: Introductionmentioning

confidence: 99%

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Macroscopic Modeling of Fine Line Adhesion Tests

Volinsky

Nelson

Gerberich³

1999

MRS Proc.

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Microwedge Indentation (MWIT) and Precracked Line Scratch (PLST) tests have been developed for adhesion measurements of microscale fine lines. In the MWIT a symmetric wedge-shaped probe is driven downward into a thin film line debonding it from the substrate. For the PLST, a precrack is introduced at one end of a thin metal line on a substrate. The line is loaded from the precrack end by an asymmetric diamond wedge until the crack propagates. When the crack reaches its critical length at a certain critical load, the film buckles.The mechanics of these tests are based on several assumptions of thin line behavior, which are not experimentally observable due to small line sizes and equipment limitations. Testing similar but larger lines allows for the direct observation of line delamination and buckling, which can be used for calculating in-situ crack lengths as well as instantaneous strain energy release rates.Both MWIT and PLST models [1][2][3][4] were experimentally verified on the macroscopic scale using polycarbonate as a line material bonded to a steel substrate with cyanoacrylate. New features such as initial crack growth as well as instantaneous crack growth at buckling were observed. Modified K IC tests were performed for strain energy release rate comparison. Adhesion values ranging from 200 to 1000 J/m 2 were measured for this system, and had very strong mode mixity dependence. Connectivity to the microscale is through previous experiments by de Boer, et al using fine line W/SiO 2 /Si systems [1][2][3][4].

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“…Novel mechanical characterization techniques have been developed to measure both residual stress and the mechanical properties of thin films. Most of them are mainly mechanics-based, such as nanoindentation (Oliver and Pharr 1992;Taylor 1991;Vlassak et al 1997;Baker and Nix 1994;De Boer and Gerberich 1996;Zhang TY et al 1999), uniaxial tensile testing of freestanding films (Mearini et al 1993;Brotzen 1994), micro-cantilever bending (Weihs et al 1988;Najafi and Suzuki 1989;Schweitz 1992;Schull and Spaepen 1996), and bulge testing (Vlassak and Nix 1992;Vinci and Nix 1996;Ziebart et al 1998). Others are mainly based on optical (Sharpe et al 1997;Espinosa 2003), X-ray scattering (Xu et al 2001) and laser-acoustic methods (Hernandez et al 2002) etc.…”

Section: Introductionmentioning

confidence: 99%

Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

Zhang¹

2007

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, seerching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and SUPPLEMENTARY NOTES14. ABSTRACT Plasma enhanced chemical vapor deposited (PECVD) silicon oxide (SiOx) is the most commonly used interlayer dielectric (ILD) in MEMS devices and structures. In this project, PECVD SiOx is chosen as an example for the systematic study of mechanical behavior and underlying casual mechanisms of amorphous thin films for MEMS applications, which are generally less well understood because of the complex interplay among the deformation mechanisms. In this project, PECVD SiO, is chosen as an example for the systematic study of mechanical behavior and underlying causal mechanisms of amorphous thin films for MEMS applications, which are generally less well understood because of the complex interplay among the deformation mechanisms. SUBJECT TERMSMechanical behaviors of the PECVD SiOx thin films are probed at 1) different size scales (from wafer level down to micro/nano-scale, and different lengthscale within each realm); 2) different temperatures (from room temperature up to 1100 0C); and 3) with a combination of different experimental techniques (such as substrate curvature measurements, nanoindentation tests, and a novel "microbridge testing" technique, etc.). A broad range of mechanical analysis is covered, including film stress and related material properties changes, elastic properties, plastic properties (both time-independent and time-dependent), deformation mechanisms (both at room temperature and elevated temperatures).Wherever applicable, materials analysis techniques such as SEM, AFM, FTIR, XRD, and SIMS were employed to strengthen the discussions on the structureproperties relationship and the causal mechanisms of the mechanical responses of the PECVD SiOx. These experiments reveal various interesting arid disiirictive characteristics of the mechanical responses of the PECVD SiOx thin films, and the microstructural causal mechanisms for each of them are analyzed in depth.The outcome of this work will provide a comprehensive characterization of the mechanical responses of the PECVD SiOx thin films under different thermal conditions, stress levels, size scales, and in both elastic and plastic regions. In addition, both new experimental methodologies and theoretical models for data 3 analysis are resulted, which can be readily applied to a wide variety of thin film materials for various different applications. Last but not least, the physical causal mechanisms for the experimental results are elucidated, ...

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Microwedge indentation of the thin film fine line—II. Experiment

Cited by 59 publications

References 33 publications

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Approaches to investigate delamination and interfacial toughness in coated systems: an overview

Macroscopic Modeling of Fine Line Adhesion Tests

Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

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