Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

Meinshausen, L.; Frémont, Hélène; Weide‐Zaage, Kirsten

doi:10.1016/j.microrel.2012.06.127

Cited by 12 publications

(3 citation statements)

References 10 publications

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“…At this interface an IMC is formed, which is a thin layer consisting of alloys with Sn as the principal component. Until now several works have been published attempting to model EM induced IMC development [3], [4], however, none of them is applicable for numerical simulation. We describe the growth of the IMC in the Sn solder bump by the following equation system:…”

Section: Physics Of Intermetallic Compound Growthmentioning

confidence: 99%

Impact of intermetallic compound on solder bump electromigration reliability

Ceric

Singulani

Orio

et al. 2013

2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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Solder bumps are important interconnect components for 3D integration. Their mechanical and electrical properties influence the overall reliability of 3D ICs. A characteristic of solder bumps is that during technology processing and usage their material composition changes. This compositional transformation influences the operation of 3D ICs and, in connection with electromigration, may cause failures in ICs. In this paper we present a model for describing the growth of intermetallic compound inside a solder bump under the influence of electromigration. Simulation results based on the new model are discussed in conjunction with corresponding experimental findings.

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Section: Physics Of Intermetallic Compound Growthmentioning

confidence: 99%

Impact of intermetallic compound on solder bump electromigration reliability

Ceric

Singulani

Orio

et al. 2013

2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

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“…Their work was presented at 100°C and 160°C. Meinshausen et al (2012) used 100°C and 120°C (ambient) (with 130-150°C working temperature due to Joule heating) to report results of 1.4-1.8·10 7 A/m 2 critical current densities. Whalley and Kristiansen (2010) reported BGA joints with 4.8·10 6 A/m 2 and polymer core CSP joints at 7.45·10 6 A/m 2 critical current densities.…”

Section: Introductionmentioning

confidence: 99%

Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

Straubinger

Géczy

Sipos

et al. 2019

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Purpose This paper aims to present a novel approach on investigating critical current densities in the solder joints of chip-size surface-mounted components or device (SMD) components and ball grid array (BGA) lead-free solder joints with the focus of via-in-pad geometries. The investigation involves a numerical approach and a physical validation with selected geometry configurations and high current loads to reveal possible failure sources. The work is a continuation of a previous study. Design/methodology/approach Current density was investigated using finite element modeling on BGA joints. Dummy BGA components, 0402 and 0603 zero ohm jumper resistors, were used, both in daisy chain setups on standard FR4 printed circuit boards (PCBs). Respective physical loading experiments were set to find effects of elevated current density at hot zones of the joints. Cross-section analysis, scanning electron microscopy and shear force tests were used to analyze the joints. Findings The findings reveal alterations in the joints, while the current loading is not directly affecting the structure. The modeling reveals the current density map in the selected formations with increased current crowding zones. Overall, the degradation does not reach the level of electromigration (EM)-induced voiding due to the limiting factor of the FR4 substrate. Practical implications The heavy current load affects joint reliability, but there are limitations of EM-induced failures on PCB-based assemblies due to the thermomechanical weakness of the FR4 material. Originality/value The experiments investigate current density from a novel aspect on frequently used BGA surface mounted components with modeling configurations focusing on possible effects of via-in-pad structure.

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“…However, the stress-strain curves obtained from bulk solder are not fully sufficient to describe the mechanical response of a solder joint. This is because a solder joint is a complex structure that encompasses many aspects such as the connection between a solder bump, copper pad and substrate, as well as the formation and growth of intermetallic compounds (IMC) and voids [7][8][9][10][11]. Therefore, the means to undertake dynamic testing of actual solder joints is highly useful for eliciting their overall mechanical response.…”

Section: Introductionmentioning

confidence: 99%

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

et al. 2015

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A novel method for dynamic testing of small specimens, based on impact loading, is proposed. This is motivated by the desire to elicit the dynamic mechanical response of single solder joints measuring 0.5 mm smaller in size. Impact loading is generated through impact of a tubular striker against a loading plate which is initially in contact with the specimen. The mechanical response of the specimen is derived from noting the stress waves generated in slender bars attached to the loading plate and specimen. Through this approach, dynamic tension or compression can be conveniently applied using the same test apparatus, and exact alignment of the slender bars attached is not critical. In addition, wave dispersion or attenuation in the bars (e.g., when polymer bars are used) has much less influence on the accuracy of results obtained. The equations governing this novel approach are derived and validated by finite element modeling. A prototype of a miniature impact tester was consequently fabricated, and tests on small aluminum specimens showed results comparable to that employing traditional split Hopkinson bar systems. The test arrangement was utilized for dynamic testing of lead-free single solder joint specimens, and initial results obtained are presented.

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Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

Cited by 12 publications

References 10 publications

Impact of intermetallic compound on solder bump electromigration reliability

Impact of intermetallic compound on solder bump electromigration reliability

Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

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