Millimeter-wave characteristics of flip-chip interconnects for multichip modules

Heinrich, W.; Jentzsch, Andreas Vargas; Baumann, G.

doi:10.1109/22.739208

Cited by 72 publications

(8 citation statements)

References 7 publications

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“…The estimated insertion loss is below 0.1 dB at 50 GHz. Slightly lower insertion losses may be expected if the bump size can be reduced to around 40 m, as reported in [16] and [17].…”

Section: -Level Packaging and Resultsmentioning

confidence: 69%

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

Carchon

Jourdain

Vendier³

et al. 2007

IEEE Trans. Adv. Packag.

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This paper reports on the development and optimization of 0/1-level packaged coplanar waveguide (CPW) lines and radio-frequency microelectromechanical systems (RF-MEMS) switches up to millimeter-wave frequencies. The 0-level package consists of an on-chip cavity obtained by flip-chip mounting a capping chip over the RF-MEMS device using BenzoCyclobutene (BCB) as the bonding and sealing material. The 0-level coplanar RF feedthroughs are implemented using BCB as the dielectric; gold stud-bumps and thermocompression are used for realizing the 1-level package. The 0-level packaged switches have been flip-chip mounted on a multilayer thin-film interconnect substrate using a high-resistivity Si carrier with embedded passives and substrate cavities. The insertion loss of a single 0/1-level transition is below 0.15 dB at 50 GHz. The measured return loss of a 0/1-level packaged 50-CPW line remains better than 19 dB up to 71 GHz and better than 15 dB up to 90 GHz. It is shown that the leak rate of BCB sealed cavities depends on the BCB width, and leak rates as low as 10 11 mbar.l/s are measured for large BCB widths ( 800 m), dropping to 10 8 mbar.l/s for BCB widths of around 100 m. Depending on the bonding conditions, shear strengths as high as 150 MPa are achieved. Index Terms-0-level packaging, integrated passives, millimeter wave, MCM-D, RF-MEMS.

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“…The estimated insertion loss is below 0.1 dB at 50 GHz. Slightly lower insertion losses may be expected if the bump size can be reduced to around 40 m, as reported in [16] and [17].…”

Section: -Level Packaging and Resultsmentioning

confidence: 69%

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

Carchon

Jourdain

Vendier³

et al. 2007

IEEE Trans. Adv. Packag.

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“…We propose a filter with input/output on top of the structure. This planar integration allows an easy connection by flip-chip techniques [13], for instance.…”

Section: Presentation Of the Structurementioning

confidence: 99%

A surface-mountable membrane supported filter

Chatras¹,

Blondy²,

Cros³

et al. 2003

IEEE Microw. Wireless Compon. Lett.

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A silicon micro-machined filter with a simple planar integration on an other substrate is proposed in this article. The excitation is made from the top of the shielding substrate of a membrane supported micro-machined filter. Packaging and inter-connection are included in the design. Experimental results are presented on a two pole 30 GHz, 4% fractional bandwidth filter with a quality factor of 602 and insertion loss of 1.8 dB. Such a filter can be easily integrated in any circuit using flip-chip technology.

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“…Flipchip technology meets fine-pitch requirements for millimeter-wave integrated circuits (MMIC) and has already been proven to be a promising alternative to wirebond interconnections up to W-band frequencies [5,6]. Instead of studbumps conductive adhesives can be applied as well for bump fabrication up to these frequencies.…”

Section: Acp-flipchip Interconnectionmentioning

confidence: 99%

A novel package approach for multichip modules based on anisotropic conductive adhesives

Heyen¹,

Jacob²

2005

2005 European Microwave Conference

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Millimeter-wave characteristics of flip-chip interconnects for multichip modules

Cited by 72 publications

References 7 publications

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

A surface-mountable membrane supported filter

A novel package approach for multichip modules based on anisotropic conductive adhesives

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