“…The tendency in modern high-frequency (HF) applications, consists in reducing the size, increasing the packing density and enhance functionality requires substrates to enable embedded passive functions [27]. Along with the high-frequency laminates [28,29] and passive integration in the high-resistivity silicon [30][31][32][33][34], a low-temperature co-fired ceramics (LTCC) is an established technology for the realization of highly integrated modules for mobile devices [35,36]. New ceramic materials based hexaferrites with a low temperature firing must be compatible firing properties, dielectric, magnetic and thermomechanical properties of a commercial glass-ceramic LTCC tapes, and the metal paste order to be made mechanically robust multi-layer structure with the required electrical characteristics.…”