MTT-S International Microwave Symposium Digest
DOI: 10.1109/mwsym.1984.1131880
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Millimeter Wave Silicon Device and Integrated Circuit Technology

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Cited by 10 publications
(5 citation statements)
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“…Next to RF-laminates [1,2] and passive integration on high ohmic silicon [3][4][5][6][7], low temperature co-fired ceramic (LTCC) is an established technology for the realization of highly integrated modules for mobile communication devices [8,9]. To realize extremely miniaturized RF modules, one technology trend is to decrease the linewidth and spacing of metal lines to reach a higher wiring density.…”
Section: Introductionmentioning
confidence: 99%
“…Next to RF-laminates [1,2] and passive integration on high ohmic silicon [3][4][5][6][7], low temperature co-fired ceramic (LTCC) is an established technology for the realization of highly integrated modules for mobile communication devices [8,9]. To realize extremely miniaturized RF modules, one technology trend is to decrease the linewidth and spacing of metal lines to reach a higher wiring density.…”
Section: Introductionmentioning
confidence: 99%
“…The tendency in modern high-frequency (HF) applications, consists in reducing the size, increasing the packing density and enhance functionality requires substrates to enable embedded passive functions [27]. Along with the high-frequency laminates [28,29] and passive integration in the high-resistivity silicon [30][31][32][33][34], a low-temperature co-fired ceramics (LTCC) is an established technology for the realization of highly integrated modules for mobile devices [35,36]. New ceramic materials based hexaferrites with a low temperature firing must be compatible firing properties, dielectric, magnetic and thermomechanical properties of a commercial glass-ceramic LTCC tapes, and the metal paste order to be made mechanically robust multi-layer structure with the required electrical characteristics.…”
Section: Co-sintering Of Ferrite and Dielec-tric Tapes Compositesmentioning
confidence: 99%
“…Nevertheless, the continuous demand for miniaturization and lower cost of radio frequency (RF)-modules in the mobile communication market poses significant challenges to the fabrication technologies and the layout of these basic functions. After the tremendous size decrease of surface mount devices (SMDs), the next steps towards further miniaturization and higher reliability are passive integration technologies like RF-laminates [1], low temperature co-fired ceramics (LTCC) technology [2], and passive integration on high resistivity silicon [3]. Next to cost, one of the main discriminators and challenges of these processes is the precision of the integrated functions [4].…”
Section: R Esonant Circuits Built Of Capacitors and Inductorsmentioning
confidence: 99%