2010 IEEE Sensors 2010
DOI: 10.1109/icsens.2010.5690057
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Miniaturized thermal flow sensors with through silicon vias for flip-chip packaging

Abstract: We present the first miniaturized, high temperature stable thermal flow sensor with through silicon vias for electrical connection on the back of the silicon chip. The electrical and mechanical connections are done by standard flip-chip bonding to a printed circuit board which leads to a simpler packaging as compared to wire bonding. Moreover, the chip size could be further reduced without any loss of performance.

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Cited by 4 publications
(4 citation statements)
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“…Flip-chip packaging involves interconnecting the sensors to external circuit (e.g., a circuit board or another chip or wafer), with solder-bumps that are deposited onto chip pads. Sosna et al developed a flow sensor based on a thermoelectric principle [ 52 ] and packaged it using flip-chip technology. Reflow-soldering process was employed to connect the sensor electrically and mechanically to a PCB.…”
Section: Packaging Of Thermal Flow Sensors In Harsh Environmentsmentioning
confidence: 99%
See 1 more Smart Citation
“…Flip-chip packaging involves interconnecting the sensors to external circuit (e.g., a circuit board or another chip or wafer), with solder-bumps that are deposited onto chip pads. Sosna et al developed a flow sensor based on a thermoelectric principle [ 52 ] and packaged it using flip-chip technology. Reflow-soldering process was employed to connect the sensor electrically and mechanically to a PCB.…”
Section: Packaging Of Thermal Flow Sensors In Harsh Environmentsmentioning
confidence: 99%
“… ( a ) Schematic illustration of a thermocouple; ( b ) Thermocouple based flow sensor reported by Sosna et al [ 52 ] (Reprinted with permission from IEEE). …”
Section: Figurementioning
confidence: 99%
“…Flip-chip packaging involves interconnecting the sensors to external circuit (e.g., a circuit board or another chip or wafer), with solder-bumps that are deposited onto chip pads. Sosna et al developed a flow sensor based on thermoelectric principle [97] and packaged it using flip-chip technology. Reflow-soldering process was employed to connect the sensor electrically and mechanically to a PCB.…”
Section: Recent Packaging Strategies Of Thermal Flow Sensorsmentioning
confidence: 99%
“…For instance, aluminium nitride, lithium niobate, lead zirconate titanate were commonly utilized for piezoelectric and ultrasonic sensing applications. [14][15][16] On the other hand, platinum 17 , diamond 18 Low-temperature cofired ceramics (LTCC) 19 , stainless steel 20 , yttriazirconia 21 and silicon compatible materials 22,23 were a few used for temperature and flow sensing applications. The application fields with these environments include aerospace 24 , automotive 25 , industrial process control 26 and sea exploration 27 .…”
Section: Introductionmentioning
confidence: 99%