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Crack‐free ceramic micropatterns made of oxidic ceramic powders, e.g. alumina, titania, zirconia, and nonoxidic calciumphosphate ceramic powders were fabricated by a novel, simple, and low‐cost modified micromolding (m‐μM) technique via polydimethylsiloxane stamps. By means of this m‐μM technique it is possible to fabricate monolithic ceramic bodies with a micropatterned surface with very high accuracy on surface detail. Our produced micropatterns can feature various geometries, e.g. cylinders, holes, channels, and struts with diameters ranging from 8 to 140 μm in diameter or widths and from 8 to 30 μm in depth or height. The oxidic and nonoxidic ceramic micropatterns could be removed from the molds and dried without any cracks. Even after sintering, these micropatterned samples showed no cracks or fissures. The reported technique has a very high potential for fully automatized up‐scale fabrication of micropatterned ceramic surfaces.

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We present the first miniaturized, high temperature stable thermal flow sensor with through silicon vias for electrical connection on the back of the silicon chip. The electrical and mechanical connections are done by standard flip-chip bonding to a printed circuit board which leads to a simpler packaging as compared to wire bonding. Moreover, the chip size could be further reduced without any loss of performance.