We present a method for the prediction of intrinsic stress in poly-SiGe thin films. The simulation of intrinsic stress effects in deposited thin film is an important issue, especially for the cantilever fabrication, because after removal of the sacrificial layer the intrinsic stress leads to an undesirable and uncontrolled deflection of the cantilever. The developed methodology to treat thin film stress is applied to analyze fabricated cantilever structures and the simulation results are compared with experiments.
INTRODUCTIONThin film deposition is a widely used technique for the fabrication of free-standing MEMS structures which can induce or sense a mechanical movement. During the deposition process of new thin layers and afterwards an intrinsic stress is generated. In subsequent process steps the underlying sacrificial layer is removed and the (stressed) deposited layer is left freestanding. As a consequence the process induced stress can relax and deform the deposited layer in an undesirable way.Polycrystalline silicon-germanium (poly-SiGe) has been promoted as an attractive material suitable as structural layer for several MEMS applications [1]. Poly-SiGe is a good alternative to polycrystalline silicon (poly-Si), because it has similar properties. The same good mechanical and electrical properties can be obtained with poly-SiGe at much lower temperatures (down to 400 • C) as compared to poly-Si (above 800 • C). These low processing temperatures enable post-processing MEMS on the top of CMOS without significant changes in the existing CMOS fabrication processes. The sacrificial layer is usually made of silicon dioxide (SiO 2 ) (see Fig. 1), because this material can be etched with a high selectivity towards the structural layer by the use of hydrogen fluoride (HF).Different aspects of the connection between microstructure and stress have been investigated in the past 30 years. The focus was mostly on some specific grain-grain boundary configurations in several stages of microstructure evolution [2]. As a result there are numerous models based on continuum mechanics, which are only applicable for simple situations. On the other hand side complex models for describing the morphology of microstructural evolution, which culminate in multi-level set models of grain evolution [3], have been developed. These models can reproduce the realistic grain boundary network in a high degree, but they do not include stress [4]. The goal of this work is the integration of microstructure models which describe strain development due to grain dynamics in a macroscopic mechanical formulation. This strain loads the mechanical problem which provides a distribution of the mechanical stress and enables the calculation of displacements in the MEMS structure.