We
investigated the synthesis of aluminum oxide (AlO
x
) thin films using mist chemical vapor deposition
(mist-CVD) from aluminum acetylacetonate (Al(acac)3) and
methanol/water (MeOH/H2O) mixture (volume ratio, 7:3).
Different deposition parameters, such as the flow rate (F
d) of dilution gas N2, furnace temperature
(T
f), solution concentration, and mesh
bias (V
m), were optimized via the analysis
of the size distribution of mist precursors using a fast-scanning
mobility particle analyzer. The film morphology, rigidity of the AlO
x
network, and junction property at the AlO
x
/n-type crystalline Si (n-Si) were dominated
by the size distribution of the mist precursors determined by the
deposition parameters. Further, the mesh bias supply during film growth
promoted the miniaturization of the size distribution of the charged
mist particles. Consequently, a marked increase in the number density
of the mist particles resulted in an increased refractive index (n) of the AlO
x
thin films with
small surface roughness values. Furthermore, such property of the
AlO
x
films improved the junction property
at the AlO
x
/n-Si interface. In this study,
the correlation between the size distribution of mist particles, which
is dependent on the deposition parameters, and the film and interface
properties, is presented together with metal-oxide–semiconductor
field-effect transistor (MOS-FET) performance for the AlO
x
thin films obtained by mist-CVD.