Mitigation of electric drivetrain oscillation resulting from abrupt current derating at low coolant flow rate

Achiri, Humphrey Mokom Njawah; Šmı́dl, Václav; Peroutka, Zdeněk

doi:10.1109/iecon.2015.7392666

Cited by 5 publications

(5 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…During asymmetrical loading of the inverter, some transistors or diodes allow higher currents than others and consequently have higher temperatures. Hence, depiction of individual diodes and transistor temperatures is necessary [3]. Placing sensors close to each transistor or diode in an IGBT module increases the overall cost of the inverter and also presents some packaging challenges.…”

Section: Introductionmentioning

confidence: 99%

“…These RC circuits describe the heat transfer between the heat source and the heat sink. Two types of RC-circuit thermal networks are most frequently used in thermal modelling of an IGBT module: Foster network [3,14,15] and Cauer network [16,17]. Thermal impedances of RC thermal networks can be determined using finite element methods [18][19][20], VCE (collector-emitter voltage) measurement methods (thermo-sensitive electrical parameter-TSEP) [21][22][23][24][25], or direct temperature measurements using sensors [21,26].…”

Section: Introductionmentioning

confidence: 99%

“…FEA models, though suited for extraction of thermal impedances, are not suited for online junction temperature estimation because of the high computational effort required [20]. Analytical junction estimation techniques [3,[30][31][32][33] are widely used in industrial applications for online junction temperature estimation because it is not computationally intensive and thus suitable for implementation on microcontroller.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Least Squares Method for Identification of IGBT Thermal Impedance Networks Using Direct Temperature Measurements

et al. 2020

Self Cite

View full text Add to dashboard Cite

State-of-the-art methods for determining thermal impedance networks for IGBT (Insulated Gate Bipolar Transistor) modules usually involves the establishment of the relationship between the measured transistor or diode voltage and temperature under homogenous temperature distribution across the IGBT module. The junction temperature is recomputed from the established voltage–temperature relationship and used in determining the thermal impedance network. This method requires accurate measurement of voltage drop across the transistors and diodes under specific designed heating and cooling profiles. Validation of the junction temperature is usually done using infrared camera or sensors placed close to the transistors or diodes (in some cases and open IGBT module) so that the measured temperature is as close to the junction as possible. In this paper, we propose an alternative method for determining the IGBT thermal impedance network using the principles of least squares. This method uses measured temperatures for defined heating and cooling cycles under different cooling conditions to determine the thermal impedance network. The results from the proposed method are compared with those obtained using state-of-the-art methods.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Least Squares Method for Identification of IGBT Thermal Impedance Networks Using Direct Temperature Measurements

et al. 2020

Self Cite

View full text Add to dashboard Cite

show abstract

“…• Reliability-oriented design in order to correctly select the inverter components [17]; • Derating strategies [18][19][20];…”

Section: Introductionmentioning

confidence: 99%

“…In order to increase the system reliability, some methodologies have proven to be a potential solution, such as: Redundancy strategies [15, 16]; Reliability‐oriented design in order to correctly select the inverter components [17]; Derating strategies [18–20]; Optimisation of the converter cooling system [21]; Periodic preventive maintenance [22]. …”

Section: Introductionmentioning

confidence: 99%

On lifetime evaluation of medium‐voltage drives based on modular multilevel converter

Júnior¹,

Cupertino

Mendonça³

et al. 2019

IET Electric Power Applications

View full text Add to dashboard Cite

Reliability is an important issue related to the modular multilevel converter (MMC)-based medium voltage (MV) drives. The design for reliability (DFR) approach has been discussed in many power electronic systems in recent years. MMC-based MV drives power losses and thermal cycling are strongly affected by start-up and low-speed operation, since zero-sequence current injection must be applied. In order to implement fast thermal simulations, the traditional DFR approach does not consider the heat sink thermal capacitance, which can significantly affect the MMC lifetime prediction. This article discusses how the heat sink realisations (material, thickness) affect the MMC-predicted lifetime and evaluates how the drive start-up time affects the damage in the power converter. The case study is based on a 1.4 MW slurry pump system driven by a three-phase induction motor. The lifetime evaluation of the MMC is realised through the Monte-Carlo simulation. The results show that the traditional approach results in an underestimation of up to 42.5% of the converter lifetime. In addition, long start-up times lead to a longer lifetime when compared to the shorter start-up times, due to the reduced thermal stresses in the semiconductors.

show abstract

Redundancy and Derating Strategies for Modular Multilevel Converter for an Electric Drive

Júnior

Farias

Cupertino

et al. 2019

J Control Autom Electr Syst

View full text Add to dashboard Cite

Mitigation of electric drivetrain oscillation resulting from abrupt current derating at low coolant flow rate

Cited by 5 publications

References 6 publications

Least Squares Method for Identification of IGBT Thermal Impedance Networks Using Direct Temperature Measurements

Least Squares Method for Identification of IGBT Thermal Impedance Networks Using Direct Temperature Measurements

On lifetime evaluation of medium‐voltage drives based on modular multilevel converter

Redundancy and Derating Strategies for Modular Multilevel Converter for an Electric Drive

Contact Info

Product

Resources

About