MMIC-to-Dielectric Waveguide Transitions for Glass Packages Above 150 GHz

Galler, Thomas; Chaloun, Tobias; Mayer, Winfried; Krohnert, Kevin; Ambrosius, Norbert; Schulz-Ruhtenberg, Malte; Waldschmidt, Christian

doi:10.1109/tmtt.2023.3236787

Cited by 2 publications

(5 citation statements)

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“…The ability to process thicker dielectrics for the radiating elements at 77 GHz helps to meet bandwidth and efficiency requirements. A radically different approach has been pursued by the authors of [93] presenting the first multilayered chip-embedded glass package for radar applications at 150 GHz (see Fig. 6).…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

“…Vertical RF signal routing through the glass substrate using TGVs are often formed as three-wire lines [28], [20], [26] and quasi-coaxial lines [50], [93]. Moreover, even multilayer glass configurations with stacked TGVs are possible, whose galvanic contacts can be established by Cu/Sn bonding (see Fig.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

“…Moreover, dielectric waveguides (DWGs) have recently gained renewed attenuation to alleviate high signal attenuation at mm-wave frequencies, since ohmic losses are avoided. While most of the reported DWGs for mm-wave applications are made from low-loss organic materials [103], [93], [104], first developments of DWGs in borosilicate glass were presented in [105] for the use in high-temperature and chemical-hazard environments.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

“…In [50], a high-performance transition between the on-chip microstrip line and the SIW section on glass has been demonstrated at D-band using a quasicoaxial configuration in a 50-μm microbump technology. Following a similar design approach, a vertical microbump transition found application in [93] to realize a broadband galvanic contact between the radar transceiver IC and the slotloaded patch element in the package, which in turn excites a DWG transmission line. Another popular technique is the use of RF interconnects which relies on electromagnetic field coupling [112], [113].…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

“…Fig. 7(e) shows an electromagnetically coupled chip-to-package transition at D-band [93]. It consists of a short-circuited quarter-wavelength patch on the chip, whereas the complementary part within the glass package is based on a stacked patch arrangement.…”

Section: Components a Transmssion Lines And Interconnectsmentioning

confidence: 99%

See 4 more Smart Citations

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Packaging and Interposer Solutionsmentioning

confidence: 99%