A novel concept for a holographic antenna-in-package (AiP) is presented enabling the seamless integration of high gain antennas at millimeter wave frequencies. The antenna is based on a holographic impedance approach stimulating a leaky wave mode at 150 GHz. Since the antenna structure is placed on top of the glass package, a large antenna aperture with high angular beam width and efficiency were achieved. The surface wave launcher (SWL) of the antenna connected to the integrated active circuitry is designed in a very compact fashion using a vertical through-glass-via (TGV) and solder balls. The performance of the proposed holographic antenna package has been investigated by an analytic model and full wave simulations. The measurement results of the antenna prototype on glass using anisotropic unit cells show excellent agreement to the simulated values. A maximum gain of 24.7 dBi, a sidelobe level of 15 dB, and a 3 dB-beam width of 4.7 • are achieved. The measured 3D-radiation pattern shows a highly directive pattern in all cuts.

This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only 5.8 mm × 4.4 mm × 0.9 mm. A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

A novel hermetically sealed RF packaging concept based on glass is presented. Using the laser induced deep etching (LIDE) technology enables the fabrication of glass vias without degrading the mechanical stability as micro-cracks are completely avoided. Furthermore, aspect ratios of up to 1:10 make this technology superior over conventional packaging solutions for the upper millimeter wave regime beyond 150 GHz. As an initial design demonstration, this paper shows a vertical RF-transition through the glass substrate using Through-Glass Vias (TGVs) with an aspect ratio larger than 1:6. The realized prototypes intended for highly efficient LO/VCO distribution within the glass package show excellent reproducibility with a maximum insertion loss of 0.4 dB up to 40 GHz. In addition, a very compact RF-interconnection from PCB to the glass package using solder balls is presented. The simulation of the RF-transition is in good agreement with the measured reflection and transition coefficient not exceeding −15 dB and −1.5 dB up to 35 GHz, respectively.

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A novel mechanically flexible filter integrated in a glass dielectric waveguide is presented for sensor applications at G-band (140-220 GHz). The use of laser-induced deep etching (LIDE) technology enables the production of via holes and thus the local modulation of the effective permittivity in a dielectric waveguide. This approach enables the implementation of a filter without the use of metal structures. In addition, extraordinary mechanical flexibility is achieved through meandering slots, which simultaneously perform the permittivity modulation. The RF performance was studied in full-wave simulations and validated by measurements of the manufactured bandstop prototypes. The experimental results of the implemented filter element show good agreement with the simulated values. At the center frequency of 156 GHz a notch depth below −14 dB in the measured stop band is achieved. Additional measurements show a stable filter characteristic at up to 8 • bend angle applicable for the use as a low-loss waveguide under harsh environmental conditions.