2020
DOI: 10.1109/lawp.2020.3022520
|View full text |Cite
|
Sign up to set email alerts
|

High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology

Abstract: A novel concept for a holographic antenna-in-package (AiP) is presented enabling the seamless integration of high gain antennas at millimeter wave frequencies. The antenna is based on a holographic impedance approach stimulating a leaky wave mode at 150 GHz. Since the antenna structure is placed on top of the glass package, a large antenna aperture with high angular beam width and efficiency were achieved. The surface wave launcher (SWL) of the antenna connected to the integrated active circuitry is designed i… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
25
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
4
2

Relationship

3
3

Authors

Journals

citations
Cited by 21 publications
(25 citation statements)
references
References 16 publications
0
25
0
Order By: Relevance
“…Again, the reason can be found in the prohibitive fabrication costs of LTCC based AiPs for consumer electronics markets targeting especially low-cost mass production. In recent years, glass-based AiPs have increasingly gained attention for mm-wave applications [6], [106], [107], [109], [125], [126], [127]. The advantage of the glass substrates are their low-loss electrical properties beyond 150 GHz, dimensional stability, ability to form fine-pitch lines, spaces, and vias, and potential availability in large-scale low-cost panels [45].…”
Section: A Integration Optionsmentioning
confidence: 99%
“…Again, the reason can be found in the prohibitive fabrication costs of LTCC based AiPs for consumer electronics markets targeting especially low-cost mass production. In recent years, glass-based AiPs have increasingly gained attention for mm-wave applications [6], [106], [107], [109], [125], [126], [127]. The advantage of the glass substrates are their low-loss electrical properties beyond 150 GHz, dimensional stability, ability to form fine-pitch lines, spaces, and vias, and potential availability in large-scale low-cost panels [45].…”
Section: A Integration Optionsmentioning
confidence: 99%
“…As a result, every UC has an assigned slot orientation due to its anisotropic tensor components. Subsequently, the geometric parameters, which yields to the lowest impedance error (see ( 5)), determines the scalar impedance as function of the incident angle φ inc,n (see 7 in Fig. 1).…”
Section: B Preliminary Consideration Of the Anisotropic Impedance Ten...mentioning
confidence: 99%
“…After determining the merged slot angle φ slot,merged , the incident angle of each feed n on the considered UC φ inc,n is included. A database matrix look-up table (LUT) is created for this purpose, containing all scalar impedance values Z s,LUT for L different aspect ratios (see (7)) and M slot angels (see Fig. 3).…”
Section: Incident Angle Dependent Impedance Mappingmentioning
confidence: 99%
See 1 more Smart Citation
“…This distance results in turn from the very precise knowledge of the melting behavior of the solder balls. Using this approach, also a direct connection to holographic antenna structures is possible [18]. Here, the central signal pad on chip connects the stub signal TGVs with a circulating gap ring (10 μm) to the ground metal.…”
Section: A Mmic-to-glass Layermentioning
confidence: 99%