Hermetically Sealed Glass Package for Highly Integrated MMICs

Galler, Thomas; Chaloun, Tobias; Krohnert, Kevin; Schulz-Ruhtenberg, Malte; Waldschmidt, Christian

doi:10.23919/eumc.2019.8910813

Cited by 10 publications

(8 citation statements)

References 6 publications

(5 reference statements)

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“…Therefore, two identical transitions are connected with a thru and a line standard in-between, respectively. From measurements of both configurations the scattering parameters of a single transition can be calculated [3]. The calibration of the network analyzer is performed with thru-reflect-line (TRL) calibration kits in the microstrip and the stripline plane.…”

Section: Measurement Resultsmentioning

confidence: 99%

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A Broadband Multilayer Vertical Transition at 79 GHz Employing FR4 as Core Material

Schwarz¹,

Riese²,

Dürr³

et al. 2022

2021 51st European Microwave Conference (EuMC)

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A novel vertical transition through a multilayer printed circuit board is presented. The transition is designed to fulfill the cost and manufacturing constraints of next generation automotive radar sensors. This is achieved both by employing FR4 as material in the transition core and the fabrication in a standard high density interconnect process. The modified design of a quasi-coaxial structure solves the limitations determined by the constraints. Although FR4 has high dielectric losses, a vertical transition through multiple FR4 layers is realized with a low insertion loss of less than 2.1 dB within the automotive radar frequency range of 76 GHz to 81 GHz. A return loss better than 10 dB is achieved up to a frequency of 83.2 GHz. The reliability and repeatability of the transition is shown by measurements of several transitions from different production cycles.

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Section: Measurement Resultsmentioning

confidence: 99%

“…In multilayer designs, simple transitions using only three vias as in [3] are not sufficient. State-of-the-art vertical transitions for highly complex boards in low temperature cofired ceramics (LTCC) imitate coaxial lines and have superior performance [4], but are very costly.…”

Section: Introductionmentioning

confidence: 99%

A Broadband Multilayer Vertical Transition at 79 GHz Employing FR4 as Core Material

Schwarz¹,

Riese²,

Dürr³

et al. 2022

2021 51st European Microwave Conference (EuMC)

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show abstract

“…In order to meet the demand for highly integrated packages for mm-wave radars, glass is used as the substrate material where the MMIC with all its interconnects are integrated on a size of 5.8 mm×4.4 mm. With respect to availability and cost, BF33 glass is a suitable material using LIDE technology [16]. With LIDE, aspect ratios for metalized TGVs larger than 8:1 can be achieved, without degrading the mechanical stability.…”

Section: Glass Technologymentioning

confidence: 99%

Glass Package for Radar MMICs Above 150 GHz

Galler¹,

Chaloun²,

Mayer

et al. 2022

IEEE J. Microw.

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This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only 5.8 mm × 4.4 mm × 0.9 mm. A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

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“…1. The package consists of two glass layers in which a radar MMIC is hermetically sealed [9]. In the upper glass layer the RF signal is guided from the packaged MMIC to the antenna by solder ball interconnections and a vertical TGV (Fig.…”

Section: Packaging Conceptmentioning

confidence: 99%

High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology

Galler¹,

Frey²,

Waldschmidt³

et al. 2020

Antennas Wirel. Propag. Lett.

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A novel concept for a holographic antenna-in-package (AiP) is presented enabling the seamless integration of high gain antennas at millimeter wave frequencies. The antenna is based on a holographic impedance approach stimulating a leaky wave mode at 150 GHz. Since the antenna structure is placed on top of the glass package, a large antenna aperture with high angular beam width and efficiency were achieved. The surface wave launcher (SWL) of the antenna connected to the integrated active circuitry is designed in a very compact fashion using a vertical through-glass-via (TGV) and solder balls. The performance of the proposed holographic antenna package has been investigated by an analytic model and full wave simulations. The measurement results of the antenna prototype on glass using anisotropic unit cells show excellent agreement to the simulated values. A maximum gain of 24.7 dBi, a sidelobe level of 15 dB, and a 3 dB-beam width of 4.7 • are achieved. The measured 3D-radiation pattern shows a highly directive pattern in all cuts.

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Hermetically Sealed Glass Package for Highly Integrated MMICs

Cited by 10 publications

References 6 publications

A Broadband Multilayer Vertical Transition at 79 GHz Employing FR4 as Core Material

A Broadband Multilayer Vertical Transition at 79 GHz Employing FR4 as Core Material

Glass Package for Radar MMICs Above 150 GHz

High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology

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