Films of CeO 2 were deposited by atomic layer deposition (ALD) using a Ce(mmp) 4 [mmp = 1-methoxy-2-methyl-2-propanolate] precursor and H 2 O reactant. The growth characteristics and film properties of ALD CeO 2 were investigated. The ALD CeO 2 process produced highly pure, stoichiometric films with polycrystalline cubic phases. Using the ALD CeO 2 process, the effects of Ce doping into an HfO 2 gate dielectric were systematically investigated. Regardless of Ce/(Ce + Hf) composition, all ALD Ce x Hf 1x O 2 films exhibited constant growth rates of approximately 1.3 A/cycle, which is essentially identical to the ALD HfO 2 growth rates. After high-temperature vacuum annealing at 900°C, it was verified, based on X-ray diffraction and high-resolution cross-sectional transmission electron microscopy results, that all samples with various Ce/ (Ce + Hf) compositions were transformed from nanocrystalline to stabilized cubic or tetragonal HfO 2 phases. In addition, the dielectric constant of the Ce x Hf 1x O 2 films significantly increased, depending on the Ce doping content. The maximum dielectric constant value was found to be nearly 39 for the Ce/(Ce + Hf) concentration of~11%.B. Dunn-contributing editor Manuscript No. 33319.