2019
DOI: 10.1088/1361-6439/ab173e
|View full text |Cite
|
Sign up to set email alerts
|

Mode II adhesion energy analysis of stiction-failed poly-Si $\mu$ cantilevers using a MEMS load cell

Abstract: This paper studies the Mode II adhesion energy of a Poly-Si µcantilever stiction failed on a poly-Si substrate. A custom flexural microelectromechanical systems (MEMS) load cell and an interferometer are used to measure the applied forces and measure the deflections in real time. From this data the Mode II strain energy release rates were determined to range between 0.520-5.10 mJ m −2 .

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2019
2019
2021
2021

Publication Types

Select...
5
2

Relationship

2
5

Authors

Journals

citations
Cited by 8 publications
(2 citation statements)
references
References 26 publications
0
2
0
Order By: Relevance
“…In such applications, designers are mainly concerned with the percentage of light transmitted into/out of the substrate and are not concerned with beam quality. On the other hand, for coupling light out of laser cavities (particularly semiconductor lasers), the absence of diffraction or scattering of the transmitted light is critical for maintaining the quality of the laser beam [3] [31] [39]. When made of same material as the transmission medium, the nanostructured antireflections can tolerate high laser powers.…”
Section: Introductionmentioning
confidence: 99%
“…In such applications, designers are mainly concerned with the percentage of light transmitted into/out of the substrate and are not concerned with beam quality. On the other hand, for coupling light out of laser cavities (particularly semiconductor lasers), the absence of diffraction or scattering of the transmitted light is critical for maintaining the quality of the laser beam [3] [31] [39]. When made of same material as the transmission medium, the nanostructured antireflections can tolerate high laser powers.…”
Section: Introductionmentioning
confidence: 99%
“…Also, when a high-power beam of light passes through them, these layers peel off the substrate [5] due to the difference in the expansion coefficient of different materials. Recently, nanotechnology and nanostructures [6] [7] [8] [9] have solved many problems in technology introducing materials [10] that exhibit special characteristics electrically, mechanically [11]- [15] and when they're under illuminations of light [6] [7] [16] [17]. Fabrication method of these nanomaterials [6] [18] [19] usually depends on the type of the materials and the physical characteristics they're designed for.…”
Section: Introductionmentioning
confidence: 99%