“…To systematically identify the performance bottlenecks and uncover possible avenues to further improve the system, a sensitivity analysis of electrochemical and microstructural parameters was conducted for the "MSC_FMS_infil" configuration by performing isothermal RU simulations at 0.8 V and 973.15−1023.15 K, as shown in Figure 8b. The dimensionless sensitivity index (SI) is calculated with respect to P el,stack V according to a ± 10% change in each parameter P, From the sensitivity plot, it can be deduced that, aside from the interconnect rib-air electrode contact resistance R contact,ae→ic , which causes the highest variation of P el,stack V and, accordingly, contributes the most to the observed cell resistance, A gas/io V , the electrolyte thickness t elyt , and the Crofer 22 H support layer thickness t fe,dl all lead to SI > 0.085 at 973.15 K. Thus, when R contact,ae→ic is assumed to be fixed, the model predicts that significant performance improvements are possible by either refining the Ni-CGO electrospun fiber-network to increase the CGO-pore phase interfacial area, e.g., by optimizing processing conditions 23 or by further reducing the layer thicknesses t elyt and t fe,dl . Moreover, it can be extracted that ion conduction in the anode CGO matrix, i.e., σ io,fe eff , causes a high SI of P el,stack V of 0.082−0.093 in the respective temperature interval, which underlines the primary importance of a well-percolating backbone structure across the relatively thin functional layer.…”