Modeling and analysis of semiconductor manufacturing in a shrinking world: Challenges and successes

Abstract

A panel session on the role of modeling and analysis in semiconductor manufacturing in a shrinking world is presented. Therefore, two participants are from Asia, two from Europe, and two from US and there are two panel organizers/moderators (Fowler and Mönch). One panelist from each continent is from industry and one from academia. Only initial position statements are included in the proceedings. However, these initial statements form the basis for the panel discussion. The statements of the panelists from industry relate to modeling and analysis problems found in their own companies. The position statements of the panelists from academia describe the role that modeling and analysis is expected to play in their current and ongoing research in semiconductor manufacturing. Furthermore, their views on the challenges and successes of modeling and analysis in a globalized world are also included.

Wertschöpfungsnetzwerk und Produktion integrieren/Integrating supply network and manufacturing: An adaptive, closed-loop-based approach

“…Die Komplexität der Wertschöpfungsnetzwerke steigt durch deren globale Verteilung, sich verändernde Strukturen und eine volatile Nachfrage. Dazu kommen der Wandel vom Verkäufermarkt zum Käufermarkt und sinkende Produktionsmengen bei gleichzeitig steigender Variantenvielfalt [1,2]. Das Marktumfeld, in welchem sich produzierende Unternehmen bewegen, wird deshalb zunehmend komplexer, volatiler, unsicherer und mehrdeutiger [3].…”

Modelling and analysis of semiconductor supply chains

“…Supply chain management (SCM) problems have existed in the semiconductor industry since the early days of the industry, but have become increasingly important in the last decade (Chien et al 2011). In the beginning, SCM problems were mainly caused by the fact that initial operations (wafer fabrication, probe) are performed in highly industrialised nations, while later operations (assembly, packaging and test) are carried out in countries where labour rates are cheaper.…”

Modeling order assignment for semiconductor assembly hierarchical outsourcing and developing the decision support system

“…Such independent service providers cover a wide range of areas that include telecommunications, software, research and development (R&D), design, manufacturing, assembly, testing, construction engineering, personnel, accounting, maintenance, etc. (Sharpe 1997;Quinn 1999;Barthélemy 2001;Chien et al 2008). Linder (2004) argued that the internal development of new capabilities is overly time-consuming.…”