Modeling and characterization of the bonding-wire interconnection for microwave MCM

Liang, Ying Chun; Huang, Chunyue; Wang, Wangang

doi:10.1109/icept.2010.5582690

Cited by 5 publications

(3 citation statements)

References 2 publications

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“…Zhu et al studied the prediction method of PLCC (plastic leaded chip carrier) solder joint shape and the factors influencing the fatigue life of solder joint [4]. Liang et al characterized the bonding wire and built a three-dimensional model using HFSS (high frequency structure simulator) to study the transmission performance of the bonding wire [5]. Putaala et al predicted the high frequency performance of the ball grid array device under thermal cycling loading by means of software simulation [6].…”

Section: Introductionmentioning

confidence: 99%

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects

Wang

et al. 2020

Electronics

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There are a large number of interconnections in the microwave module, among which the lead wire interconnection is widely used. Under the environmental load, the solder joint of the lead wire interconnection often appears to have cracks and other defects, which directly affect the return loss and insertion loss when transmitting electrical signals through solder joints, and indirectly affect the performance of the microwave module. For this reason, the segmented modeling method is realized by segmenting the lead wire interconnection structure into two parts in this paper, and the equivalent circuit model of the lead wire interconnection with the cracked solder joint is established using the equivalent circuit method. The correlation mechanism of the shape of the solder joint of the lead wire interconnection is studied, and formulas for predicting electrical performance based on return loss and insertion loss are derived. This paper realizes the prediction of the electrical performance of the lead wire interconnection with the defect, and can provide a reference for engineers and technicians.

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Section: Introductionmentioning

confidence: 99%

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects

Wang

et al. 2020

Electronics

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“…Liang studied the height arch of single gold bonding wire and the results showed that the lower the arch height of bonding gold wire the better in the case of single gold and the same span. But the value of high arches in the simulation cannot guarantee the welding stability of flat bonding gold because of the characteristics of bonding process [18]. Owing to the diversity of the IC products and package types, there are still no satisfactory results on effects such as wire loops, geometric parameters, electromagnetic models, overall package design and other factors on comprehensive IC electromagnetic properties.…”

Section: Introductionmentioning

confidence: 99%

Analysis and Experimental Test of Electrical Characteristics on Bonding Wire

Tian

Cui

2019

Electronics

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In this paper, electrical characteristic analysis and corresponding experimental tests on gold bonding wire are presented. Firstly, according to EIA (Electronic Industries Association)/JEDEC97 standards, this paper establishes the electromagnetic structure model of gold bonding wire. The parameters, including flat length ratio, diameter, span and bonding height, were analyzed. In addition, the influence of three kinds of loops of bonding wire is discussed in relation to the S parameters. An equivalent circuit model of bonding wire is proposed. The effect of bonding wire on signal transmission was analyzed by eye diagram as well. Secondly, gold bonding wire design and measurement experiments were implemented based on radio frequency (RF) circuit theory analysis and test methods. Meanwhile, the original measurement data was compared with the simulation model data and the error was analyzed. At last, the data of five frequency points were processed to eliminate the fixture error as much as possible based on port embedding theory. The measurement results using port extension method were compared with the original measurement data and electromagnetic field simulation data, which proved the correctness of the simulation results and design rules.

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“…Although the wire bonding and TAB technology have advantages such as relatively low cost and high reliability, the bonded wire and tape generate a parasitic inductance and take up large space. Therefore, these technologies have a limitation on the integration density [2][3][4]. Flip-chip bonding technology has been increasingly exploited for the development of monolithic microwave integrated circuits and system in package, where the technology provides higher integration density, relatively good simplicity, low cost, lead-free processing [5,6].…”

mentioning

confidence: 99%

Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications

et al. 2018

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In this Letter, a flip-chip bonding based on ink-jet printing technology is proposed and verified by interconnecting a separated coplanar waveguide (CPW) samples. Before the flip-chip bonding process, diameter and height of ink-jet printed silver bumps for flip-chip bonding are measured to be about 300 and 13 µm, respectively. In a frequency range from 300 kHz to 3 GHz, return loss and insertion loss of the flip-chip bonded CPW samples are measured to be higher than 20 dB and lower than 1.8 dB, respectively, where the length of the signal line is 35 mm. There are negligible discrepancies between radio frequency (RF) characteristics of the flip-chip bonded CPW and those of a conventional CPW. These results show that the proposed flip-chip bonding can be used to integrate RF components into electronic devices with low-loss using simple procedures.

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Modeling and characterization of the bonding-wire interconnection for microwave MCM

Cited by 5 publications

References 2 publications

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects

Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects

Analysis and Experimental Test of Electrical Characteristics on Bonding Wire

Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications

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