Modeling and control of a semiconductor manufacturing process with an automata network: An example in plasma etch processing

Rietman, Edward A.; Patel, Suresh H.; Lory, Earl R.

doi:10.1016/0305-0548(95)00062-3

Cited by 6 publications

(1 citation statement)

References 16 publications

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“…Plasma, as a new clean and important energy source, has the advantages of high temperature, high enthalpy, high energy concentration, and controllable compositions. Hence, it has been widely used in metallurgy [1], electric-arc furnaces [2], semiconductor processing [3], material surface modification [4], environmental protection [5], and other fields. Plasma is a mixture of neutral molecules and/or atoms produced by a series of chemical reactions.…”

Section: Introductionmentioning

confidence: 99%

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Chi¹,

Zhang²,

Yang³

2021

Plasma Sci. Technol.

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The equilibrium compositions and thermodynamic properties (density, enthalpy, etc at constant pressure) of plasma of pure gases and mixtures under local thermodynamic nonequilibrium have been calculated in this paper. The homotopy Levenberg–Marquardt algorithm was proposed to accurately solve nonlinear equations with singular Jacobian matrices, and is constructed by the Saha equation and Guldberg–Waage equation combined with mass conservation, the electric neutrality principle and Dalton’s partial pressure law, to solve the problem of dependence on the initial value in the process of iteration calculation. In this research, the equations at a higher temperature were solved and used as the auxiliary equations, and the homotopy control parameters’ sequence of the homotopy equations was selected by equal ratios. For auxiliary equations, the iterative initial value was obtained by assuming that there were only the highest-valence atomic cations and electrons at this temperature, and the plasma equilibrium composition distribution with the required accuracy was ultimately solved under the current conditions employing the Levenberg–Marquardt algorithm. The control parameter sequence was arranged according to the geometric sequence and the homotopy step was gradually shortened to ensure continuity of the homotopy process. Finally, the equilibrium composition and thermodynamic properties of pure N2, Mg(30%)–CO2(70%) and Mg(40%)–CO(50%)–N2(10%) mixture plasma at atmospheric pressure were calculated and the calculation process of some specified temperatures was shown and analyzed. The calculation accuracy of equilibrium composition is higher than other findings in the literature. The results for the thermodynamic properties are in good agreement with data reported by the literature.

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Section: Introductionmentioning

confidence: 99%

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Chi¹,

Zhang²,

Yang³

2021

Plasma Sci. Technol.

View full text Add to dashboard Cite

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Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations

Hsu

2013

J Intell Manuf

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A bibliography of neural network business applications research: 1994–1998

Wong¹,

Lai

Lam

2000

Computers & Operations Research

125

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Modeling and control of a semiconductor manufacturing process with an automata network: An example in plasma etch processing

Cited by 6 publications

References 16 publications

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations

A bibliography of neural network business applications research: 1994–1998

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Modeling and control of a semiconductor manufacturing process with an automata network: An example in plasma etch processing

Cited by 6 publications

References 16 publications

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations

A bibliography of neural network business applications research: 1994–1998

Contact Info

Product

Resources

About

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions

Thermophysical properties of pure gases and mixtures at temperatures of 300–30 000 K and atmospheric pressure: thermodynamic properties and solution of equilibrium compositions