2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018
DOI: 10.1109/ectc.2018.00078
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Modeling and Design of a 3D Interconnect Based Circuit Cell Formed with 3D SiP Techniques Mimicking Brain Neurons for Neuromorphic Computing Applications

Min Miao
1
,
Liyuan Wang
2
,
Tianfang Chen
3
et al.
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Cited by 6 publications
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