Silicon Photonics XVII 2022
DOI: 10.1117/12.2609537
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Modeling and design of an electrically pumped SiGeSn microring laser

Abstract: We present a suspended SiGeSn microring laser design that enables strain relaxation of the material layer stack, electrical pumping and adequate heat sinking. Using both strain and composition as two degrees of freedom to engineer the band structure, a direct bandgap is obtained in the gain material of a double heterostructure layer stack, and the L-to G-valley energy difference increased to 78 meV, by 66% compared to a non-underetched structure. The temperature dependent current threshold is modeled for the d… Show more

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Cited by 3 publications
(5 citation statements)
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“…28 Figure 2e shows the net modal gain versus injection-current density, at 50 K, for devices with R o = 5.5 μm, following previously made modeling assumptions. 22,28 Both a disk without inner hole and a ring with R i = 1 μm, that correspond to devices A and D (see Table 1), are modeled. For the ring's inner hole, the actual undercut length obtained from the crosssectional TEM has been considered.…”
Section: ■ Materials and Device Designmentioning
confidence: 99%
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“…28 Figure 2e shows the net modal gain versus injection-current density, at 50 K, for devices with R o = 5.5 μm, following previously made modeling assumptions. 22,28 Both a disk without inner hole and a ring with R i = 1 μm, that correspond to devices A and D (see Table 1), are modeled. For the ring's inner hole, the actual undercut length obtained from the crosssectional TEM has been considered.…”
Section: ■ Materials and Device Designmentioning
confidence: 99%
“…The latter is composed of 60 nm doped to 2 × 10 18 cm –3 , followed by 20 nm 5 × 10 19 cm –3 , and facilitates the injection and transport of electrons into the active region with a reasonable series resistance. For holes, the device relies on defectivity driven p-doping of the lower layers . Prior to undercut, the as-grown optically active material features −0.35% biaxial compressive heteroepitaxial strain determined by X-ray diffraction.…”
Section: Materials and Device Designmentioning
confidence: 99%
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