Modeling and simulation of the probe tip based nanochannel scratching

Guo, Zhiyong; Tian, Yanling; Liu, Xianping; Wang, F.; Zhou, Chong; Zhang, D.

doi:10.1016/j.precisioneng.2017.02.002

Cited by 13 publications

(6 citation statements)

References 32 publications

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“…The possible reason is that in the scratching direction d2, the cutting tool is a pyramidal face rather than a blade, which leads to the material stack in front of the probe tip, as a result, the tip-sample interface is increased greatly, thus resulting in the reduction of scratching depth, this phenomenon has been found in the scratching simulation [29]. The scratching depth in the d1 direction is smaller than those in the d3/d4 directions, this may be caused by the assembly error of the probe.…”

Section: The Indentation Testmentioning

confidence: 96%

Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

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Based on the self-developed three dimensional micro/nano machining system, the effects of machining parameters and sample material on micro/nano machining are investigated. The micro/nano machining system is mainly composed of the probe system and micro/nano positioning stage. The former is applied to control the normal load and the latter is utilized to realize high precision motion in the xy plane. A sample examination method is firstly introduced to estimate whether the sample is placed horizontally. The machining parameters include scratching direction, speed, cycles, normal load and feed. According to the experimental results, the scratching depth is significantly affected by the normal load in all four defined scratching directions but is rarely influenced by the scratching speed. The increase of scratching cycle number can increase the scratching depth as well as smooth the groove wall. In addition, the scratching tests of silicon and copper attest that the harder material is easier to be removed. In the scratching with different feed amount, the machining results indicate that the machined depth increases as the feed reduces. Further, a cubic polynomial is used to fit the experimental results to predict the scratching depth. With the selected machining parameters of scratching direction d3/d4, scratching speed 5μm/s and feed 0.06μm, some more micro structures including stair, sinusoidal groove, Chinese character "田", "TJU" and Chinese panda have been fabricated on the silicon substrate.

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Section: The Indentation Testmentioning

confidence: 96%

Experimental investigation of the tip based micro/nano machining

Guo

Tian

Liu

et al. 2017

Applied Surface Science

Self Cite

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“…Researches have revealed that nanoscratching of hard-brittle materials is a complex process with multiple influencing factors, including scratch speed [6][7][8], shape and geometric parameters of tool [9,10], environment [11], and so on. In addition, many scholars have conducted studies to explore the effect of scratch directions in the processing of materials [12][13][14][15][16]. Yan investigated the material removal state under different scratch directions employing AFM on single crystal copper, it is found that the height of pile-up is greatly influenced by scratch directions [17].…”

Section: Introductionmentioning

confidence: 99%

Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

et al. 2020

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In order to study the influence of scratch direction on the deformation characteristics and material removal mechanism of optical glass BK7, nanoscratching experiments were conducted on a Nano indenter using Vickers indenter. Results indicate that the face-forward scratch is more likely to induce the initiation and propagation of lateral cracks, which is found to be more beneficial to material removal processes; in contrast, small chips and debris are released from the machined grooves without introducing lateral cracks in the edge-forward condition, leading to poor material removal efficiency. In addition, the choice of scratch direction can make differences to the elastic recovery rate of optical glass BK7. The results revealed that both the elastic recovery rate and the residual stresses of the material under the face-forward scratching are greater than those of the edge-forward scratching. A theoretical model for coefficient of friction (COF) under different scratch directions was established. It is found that the COF between indenter and workpiece in the edge-forward scratching is larger than the face-forward scratching under otherwise identical conditions, this finding is consistent with experimental results. A stress field analysis using finite element method (FEM) was conducted to understand the different crack initiation and propagation behaviors from different scratch directions. The current study discusses the significance of scratch direction on material removal behavior of optical glass BK7, and the results would encourage further research on investigating the connections between tool geometry and material removal mechanism.

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“…Compared to conventional macro positioning system, compliant micro/nano positioning system can realize nanometric resolution through the elastic deformation of flexure hinges, which has the advantages of no friction [7][8][9][10][11], no backlash, no lubrication and easy fabrication, whereas the travel range is usually limited from a few microns to several millimeters. In many application fields like probe tip-based micro/nano scratching, there have been quite a few demands of large stroke positioning [12][13][14], and many efforts have been devoted to realizing high precision and large workspace simultaneously. In order to compensate the positioning error of coarse actuator, the fine actuation part should have the ability to realize nanometric resolution in two perpendicular directions, and the motion stroke should be greater than the minimum resolution of coarse actuator, which is usually about several tens of microns.…”

Section: Introductionmentioning

confidence: 99%