2003
DOI: 10.1016/s1350-4495(02)00185-8
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Modeling of dark characteristics of mercury cadmium telluride n+–p junctions

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Cited by 41 publications
(26 citation statements)
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“…The voltage dependences of SCR differential resistance are different for MIS structures with and without graded-band-gap layers. Those with 3,5,7) and capacitance ( 2,4,6,8) of MIS structure versus semiconductor near-surface layer resistance at 200 kHz, for dielectric capacitance 600 pF, bulk resistance 0 (1-4) and 210 Ω ( 5-8), semiconductor near-surface layer capacitance 1000 (1, 2, 5, 6) and 5000 pF (3,4,7,8).…”
Section: Formulas For Calculating Semiconductor Equivalent-circuit Comentioning
confidence: 99%
See 1 more Smart Citation
“…The voltage dependences of SCR differential resistance are different for MIS structures with and without graded-band-gap layers. Those with 3,5,7) and capacitance ( 2,4,6,8) of MIS structure versus semiconductor near-surface layer resistance at 200 kHz, for dielectric capacitance 600 pF, bulk resistance 0 (1-4) and 210 Ω ( 5-8), semiconductor near-surface layer capacitance 1000 (1, 2, 5, 6) and 5000 pF (3,4,7,8).…”
Section: Formulas For Calculating Semiconductor Equivalent-circuit Comentioning
confidence: 99%
“…The conductance of MIS structures in strong inversion provides information on the differential resistance of space-charge region (SCR) which determines the rate of recombination of minority carriers in the SCR. The product of the SCR differential resistance and the area (R SCR A d ) is the most important characteristic of MIS photodiodes [4,5] as well as photodiodes where the p-n transition is generated by doping [6,7]. Thus, in [4], for bulk HgCdTe of composition 0.22 the maximum value of those cited in literature R SCR A d = 120 Ω⋅cm 2 at 77 K is listed, whereas in [8], for epitaxial HgCdTe with composition 0.223 without a near-surface graded-band-gap layer, the values…”
mentioning
confidence: 99%
“…The other current components [11] are generation-recombination current in the depletion region, band-to-band tunnelling current, trap assisted tunnelling current and an ohmic component due to dislocations and surface leakage currents. The individual current components can be isolated from an analysis of the measured current-voltage characteristics [12,13] or a study of the temperature dependence of dark current and dynamic impedance of the diode [14,15].…”
Section: /F Noise Modelmentioning
confidence: 99%
“…[1][2][3][4][5] The performance of these systems is largely limited by the magnitude of the photodiode dark current, which is found to be sensitive to the fabrication process. 6,7 However, the fabrication processes of HgCdTe-based devices are far less mature than those for Si-based devices.…”
Section: Introductionmentioning
confidence: 99%