Modeling of ESD and EMI problems in split multi-layer power distribution network

Abstract

ESD and EMI problems and their possible solufions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split U 0 port ground with stitching element such as conductor or inductor is proposed. while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiafion from the split power plane. Simulations based on 3D-Finite Dlfference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

Anti-interference of the tribological test-bed for thrust bearings used in submersible pumps

“…Body capacity could discharge in way of collective energy, emit pulses of spectrum less than 500Hz and 30A which could put crosstalk on receiver and sender in serial interface circuit of RS-232C/RS-485 in conductive coupling. Intermodulation in receiver will formed if anti ESD structure could not deal with a certain interference wave, which will lead to the failure of data transmission or switching [4] . In addition, static discharge could make loop between input end and VCC which drives IC power unit inversely.…”

The Isolation Island and the Displacement of Decoupling Capacitors forPower Integrity Issues

“…A large number of structures will be discussed to improve the delta-I noise. For example, the sensitivity components at island board to separate delta-I noise, ferrite bead between island board and power plane [2] ~ [4], and bridge connected between the island board and the power plane [4] ~ [7].…”