ESD and EMI problems and their possible solufions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split U 0 port ground with stitching element such as conductor or inductor is proposed. while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiafion from the split power plane. Simulations based on 3D-Finite Dlfference Time Domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

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