Modeling the influence of mold compound and temperature profile on board level reliability of single die QFN packages

Serebreni, Maxim; McCluskey, Patrick; Ferris, Tyler; Sharon, Gil; Blattau, Nathan; Hillman, Craig

doi:10.1109/eurosime.2018.8369869

Cited by 10 publications

(8 citation statements)

References 12 publications

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“…This results in an RF port structure with a size of 0.32 mm×0.20 mm, which occupies only 3.5% of the chip area. Solder balls with a diameter of 50 μm connect the chip with the metalized bottom layer of dielectric 2 . Due to the cylindrical arrangement of the ground solder balls, a quasicoaxial field distribution is formed, as shown in Fig.…”

Section: A Mmic-to-glass Layermentioning

confidence: 99%

“…Conventional solutions like quad-flat-no-lead (QFN) [2], [3] suffer from high dielectric losses due to epoxy based mold compounds. Hence, the radiation efficiency of antennas covered by mold compounds is low.…”

Section: Introductionmentioning

confidence: 99%

“…Fig.8illustrates the SIW transition in the glass layer2 consisting of the U-shaped excitation structure complementary on the chip and a stepwise increase of the SIW width for impedance matching. An arrangement of three redundant TGVs with a diameter of d TGV,(2) = 20 μm are used to feed the signal vertically through the 100 μm thick layer of glass.…”

mentioning

confidence: 99%

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Glass Package for Radar MMICs Above 150 GHz

Galler¹,

Chaloun²,

Mayer

et al. 2022

IEEE J. Microw.

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This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only 5.8 mm × 4.4 mm × 0.9 mm. A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

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Section: A Mmic-to-glass Layermentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Glass Package for Radar MMICs Above 150 GHz

Galler¹,

Chaloun²,

Mayer

et al. 2022

IEEE J. Microw.

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show abstract

“…Solder joint reliability in bottom terminated component depends on both the board properties as well as component characteristics such as the die size and mold compound especially to its coefficient of thermal expansion (CTE) as shown in Quad Flat No packages. Thermal cycle profile also has an influence on the board level solder joint reliability [3]. While some believe that voids will act as stress concentrators, reducing the solder joint fatigue life, voids located in the bulk of the solder do not affect thermo-mechanical fatigue life of the solder joint [4].…”

Section: Fig 1 Schematic Of a Semiconductor Package With Different mentioning

confidence: 99%

“…Several studies on board-level reliability uses finite element analysis (FEA) technique [3,[5][6]10,[12][13][14][15][16]. This computer simulation has become popular with solder joint reliability modeling because it enables faster evaluation of design options before the actual semiconductor package is built.…”

Section: Solder Joint Reliabi Modelingmentioning

confidence: 99%

Study on the Impact of Lead Sidewall Solder Coverage and Corner Lead Size on Joint Reliability

Talledo¹

2021

JERR

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Solder joint reliability is very important to ensure that an integrated circuit (IC) semiconductor package is functional within its intended life span as the solder joint establishes electrical connection between the IC and the printed circuit board (PCB). Solder fatigue failure or crack under thermal cycling is one of the common problems with board-mounted packages. There are several factors or package characteristics that have impact on solder fatigue life like package size and material properties of the package components. This paper presents a thermo-mechanical modeling of a leadframe-based semiconductor package to study the impact of lead sidewall solder coverage and corner lead size on the solder joint reliability. Finite element analysis (FEA) technique was used to calculate the solder life considering 50% and 100% package lead sidewall solder coverage as well as smaller and larger critical corner leads of the package. The results of the analysis showed that higher lead sidewall solder coverage and larger lead could significantly increase solder life. Therefore, ensuring lead sidewall solder wettability to have higher solder coverage is beneficial. The study also reveals that packages with side wettable flanks are not only enabling high speed automated optical inspection required for the automotive industry, but they are also providing improved solder joint reliability.

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Thermal Cycling and General Reliability Considerations

Serebreni

2020

Lead‐free Soldering Process Development and Reliability

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Modeling the influence of mold compound and temperature profile on board level reliability of single die QFN packages

Cited by 10 publications

References 12 publications

Glass Package for Radar MMICs Above 150 GHz

Glass Package for Radar MMICs Above 150 GHz

Study on the Impact of Lead Sidewall Solder Coverage and Corner Lead Size on Joint Reliability

Thermal Cycling and General Reliability Considerations

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