Modeling the Lifetime of Printed Silver Conductors in Cyclic Bending With the Coffin–Manson Relation

Flexible Electronics Non-Destructive Uniformity Characterization by Synchronized Thermography

“…For example, the effect of pn-junction heating during the powering and the effect of heat conduction on the foil could clarify many of the observed phenomena. That approach would enable the analysis the effect of environmental conditions on the lifetime of this type of products in various conditions to deepen the understanding of reliability of flexible, large area electronics [10][11][12].…”

Bending machine for testing reliability of flexible electronics

“…6 that the increase in R solely comes from the ACP interconnects (black curves), since the printed Ag lines (blue curves) were shown not to be affected by the repeated bending in the range of cycles applied in our study. This is in contrast to Happonen et al [6] who estimated, using a Coffin-Manson curve fit, that Ag lines bent at a 25 mm radius in tensile For clarity, the inset in Fig. 6 shows the methodology for using cycle number at failure to estimate the scale parameter, λ, for a set of experimental conditions.…”

A RAMS analysis for a precision scale-up configuration of “Smart Street" pilot site: an Industry 4.0 Case Study

“…The Smart Street system has been examined in the form of a pilot system with a number of LED lamps reduced to five, one of which is equipped with a video camera. A possible increase or decrease in the number of the lamps without a camera does not significantly affect the philosophy of the approach to the reliability study of the overall system [93].…”