2016 12th International Congress Molded Interconnect Devices (MID) 2016
DOI: 10.1109/icmid.2016.7738936
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Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing

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Cited by 6 publications
(6 citation statements)
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“…A matching capacitor 2 is also added for matching impedance on receiving side. A previous work on the manufacturing of 3D-MID inductors for another application has showed that inductors with a quality factor higher than 100, can be obtained with a combination of laser structuring, electroless copper deposition and electrodeposition of a copper layer of 28 μm [11]. As explained previously, high quality inductors are required for inductive resonant WPT.…”
Section: Design Of the Receivermentioning
confidence: 86%
“…A matching capacitor 2 is also added for matching impedance on receiving side. A previous work on the manufacturing of 3D-MID inductors for another application has showed that inductors with a quality factor higher than 100, can be obtained with a combination of laser structuring, electroless copper deposition and electrodeposition of a copper layer of 28 μm [11]. As explained previously, high quality inductors are required for inductive resonant WPT.…”
Section: Design Of the Receivermentioning
confidence: 86%
“…Multidirectional receivers require coils with a 3D design that can be made with the 3D MID technology [9]. Previous work showed a way for designing high quality 3D MID inductors [10]. In addition, 3D MID, which allows (relatively) easy integration of 3D inductance coils at the surface of everyday objects.…”
Section: Discussionmentioning
confidence: 99%
“…La technologie plastronique 3D permet de réaliser des inductances non planaires avec un facteur de qualité suffisant et de les disposer par exemple sur une sphère (13). En l'occurrence, le dispositif prévu est composé de deux demi-sphères avec 11 inductances réparties à la surface.…”
Section: Présentation Du Dispositif Et Principe De Fonctionnementunclassified