2018 13th International Congress Molded Interconnect Devices (MID) 2018
DOI: 10.1109/icmid.2018.8526962
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The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer

Abstract: Omnidirectional inductive wireless charging system of a mobile is studied. Instead of using conventional planar coils printed on circuit boards, 3D Molded Interconnect Device (3D-MID) coils are used. The receiver is a single piece that has 3 elliptic inductors pointing in 3 different directions of the space. A half meter cubic box with 4 planar emitting inductors on 4 sides is used to transmit power at 6.78 MHz to the receiver inside the cube, regardless to the position and orientation of the receiver. Measure… Show more

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Cited by 7 publications
(5 citation statements)
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“…Figure 18. Examples of wirelessly-powered cage systems offering omnidirectional power transmission, presented in (a) [34], (b) [35], (c) [36], and (d) [22]. Figure 18.…”
Section: Wirelessly-powered Cage Systems For Omnidirectional Power Trmentioning
confidence: 99%
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“…Figure 18. Examples of wirelessly-powered cage systems offering omnidirectional power transmission, presented in (a) [34], (b) [35], (c) [36], and (d) [22]. Figure 18.…”
Section: Wirelessly-powered Cage Systems For Omnidirectional Power Trmentioning
confidence: 99%
“…In addition to the EnerCage-HC2 system, there are three other inductive link configurations that have been proposed to address omnidirectional wireless powering [22,35,36]. One possible coil configuration is a set of triple orthogonal Rx coils together with a single Tx coil.…”
Section: Wirelessly-powered Cage Systems For Omnidirectional Power Trmentioning
confidence: 99%
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“…The formation of specific metal patterns on three-dimensional (3D) plastic parts has attracted a great deal of research interest because of potential applications in 3D smart electronics, telecommunication technology, micro/nanosensors, microelectromechanical systems (MEMS), and even quantum science . In contrast to traditional two-dimensional (2D) printed circuit boards (PCBs), 3D metal–plastic composite functional devices have more complex, and sophisticated structures with higher degrees of design freedom and higher integration.…”
Section: Introductionmentioning
confidence: 99%
“…3D conductive tracks are structured to interconnect electronic components, such as Surface Mount Devices (for example capacitors in this work), which are soldered on the surfaces. In some cases, such as in this work, the 3D conductive tracks can be directly used [antennas [15], inductances [16], eddy current sensor [17], etc.]. 3D Plastronics allows improved integration of heterogeneous functions (mechatronic, optical, thermal, fluidic, etc.)…”
Section: Introductionmentioning
confidence: 99%