Modelling and analysis of vibration on power electronic module structure and application of model order reduction

Abstract

Modelling and analysis of vibration of an IGBT power electronic module (PEM) structure were undertaken. PEM structure considered in this study was without molding compound and wirebonds. The most critical resonant frequency was identified by modal analysis. At the critical frequency of 1345Hz, for the vertical displacement of the base excitation, subsequent stress distribution on the PEM structure was analysed. Concurrent vibration and thermo-mechanical fatigue loads on the reliability of PEM structure solder interconnects were also estimated by widely used linear damage superposition approach. It was concluded that the at critical resonant frequency the vibration induced damage is more severe than the thermo-mechanical fatigue loading. In addition, a quarter car model (QCM) was used to mimic the dynamic interaction between the rough road surface and an electric vehicle (EV) in order to analyse the road surface roughness induced excitation on the PEM structure in the engine compartment. Stress and strain distribution on the PEM structure due to road surface roughness were analysed. Furthermore, three Krylov subspace based model order reduction (MOR) techniques were applied to the resulting dynamic system in vibration analysis. Due to the limits on computing resources, a submodel was utilized for MOR analysis. Within the three MOR techniques, Passive Reduced order Interconnect Macromodeling Algorithm (PRIMA) MOR technique performs better than the other techniques. Computational time ratio between reduced system iteration and the full system iteration is 1:53.

Development of Process Oriented Guided Inquiry Learning-based E-Module to Improve Critical Thinking Skill

“…Thus, learning media are needed to accommodate the essential empowerment of thinking skills. In addition, the way to improve critical thinking skills is to develop teaching materials such as electronic e-modules (e-modules) (Pierce & de Man, 2019; Rajaguru et al, 2020;Wahidah et al, 2019).…”

“…In addition, the way to improve critical thinking skills is to develop teaching materials such as electronic e-modules (e-modules) (Pierce & de Man, 2019;Rajaguru et al, 2020;Wahidah et al, 2019). E-modules have strategic value in practicing critical thinking skills.…”

Investigation of the Degradation Mechanism of SiC MOSFET Subjected to Multiple Stresses

“…JiaJia Guan et al further considered the response of power devices to random vibration under thermal loads and found that thermal stress can affect the structural stiffness and thus stress under vibration [ 3 ]. Pushpa Rajaguru assessed solder layer reliability under thermal and vibrational loads and concluded that vibration-induced damage surpasses damage from thermomechanical fatigue at critical resonant frequencies [ 4 ]. Xinlan Hu et al used finite element simulation to study the combined effects of electrical–thermal loads and random vibrations on solder joint reliability [ 5 ].…”

Research on the Reliability of a Core Control Unit of Highway Electromechanical Equipment Based on Virtual Sensor Data

“…By establishing the finite element model of electronic packaging devices, Qin [ 17 ] carried out a series of vibration fatigue experiments on the solder joints of electronic packaging devices, and modified the Steinberg model according to the research results. Rajaguru modeled and analyzed the vibration of the power electronic module (PEM) structure, taking the random vibration of the vehicle as the excitation, and drew the conclusion that the vibration has an obvious influence on the fatigue life of the electronic structure [ 18 ]. Similarly, with the road load as the incentive, the research results of Wang show that even the piezoelectric energy collector specifically used to collect road vibration energy will experience the problem of performance degradation under the continuous action of traffic load [ 19 ].…”