2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2017
DOI: 10.1109/therminic.2017.8233806
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Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases

Bernhard Wunderle
1
,
Jens Heilmann
2
,
Daniel May
3
et al.
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Cited by 3 publications
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References 9 publications
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Accelerated Pump Out Testing for Thermal Greases

Wunderle
1
,
May
2
,
Heilmann
3
et al. 2019
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
8
0
0
0
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Accelerated Pump Out Testing for Thermal Greases

Wunderle
1
,
May
2
,
Heilmann
3
et al. 2019
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
8
0
0
0
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A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation

Wunderle
1
,
May
2
,
Heilmann
3
et al. 2018
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
8
0
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0
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Accelerated Test For Thermal Grease Pump-out

Gonzalez,
Li,
Bhagwagar
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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