Modelling of a pin-fin heat converter with fluid cooling for power semiconductor modules

Khorunzhii, I. A.; Gabor, Hubertus; Job, R.; Fahrner, W. R.; Baumann, Heinrich

doi:10.1002/er.918

Cited by 11 publications

(6 citation statements)

References 9 publications

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“…Khorunzhii et al [21] numerically studied the entire thermal fluid field of heat sink containing miniature pin fins with finite element method. In their investigation, the volume flow rate is very high for more than 50 ml/s.…”

Section: Introductionmentioning

confidence: 99%

The heat transfer characteristics of liquid cooling heat sink with micro pin fins

Chiu

Hsieh

Wang

et al. 2017

International Communications in Heat and Mass Transfer

104

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Section: Introductionmentioning

confidence: 99%

The heat transfer characteristics of liquid cooling heat sink with micro pin fins

Chiu

Hsieh

Wang

et al. 2017

International Communications in Heat and Mass Transfer

104

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“…The volume flow rate was above 80ml/sec. The averaged Nusselt number was found to be proportional to 0.84-0.93 power of averaged Reynolds number in [11] while 0.6 power in [18,19]. The difference might come from the aspect ratio of fins.…”

Section: Introductionmentioning

confidence: 91%

“…Comparatively, the performance of micro-pin-fins comparatively received less attention. Pin fin heatsinks have been widely used at conventional scale in industry [8][9][10][11], while limited studies at micro/mini scale have been conducted [12][13][14][15][16][17][18]. Micro pin fins own the advantages of low flow resistance and high heat transfer surface.…”

Section: Introductionmentioning

confidence: 99%

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Numerical Analysis on the Heat Transfer of Heatsink with Micro-Pin-Fins

2013

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This paper numerically studies the heat transfer in heat sinks with micro-pin-fins. Commercial software, ICEPAK, was used to explore the effect of micro-pin-fin array design on the flow rate and heat transfer characteristics of liquid cooling heat sink. The parameters include the diameter of pin fin, the gap between the pin fins, and the relative position between the pin fins. The diameters of the pin fin are 0.5mm, 0.6mm, and 0.7mm, respectively. The gap between the pin fins are 0.2mm, 0.25mm, 0.3mm, 0.4mm, and 0.5mm, respectively. Three types of fin array arrangements are set with different longitudinal spacing and transverse spacing. The driving force of the working fluid is the pressure head with 500, 1500, and 3000 Pa, respectively. Results show that the effective thermal resistance ranges from 0.27 to 0.55 with the power density of 300kW/m 2 . IntroductionEfficient cooling technologies have been developed to meet the heat dissipation of high heat flux of electronic devices, e.g. projector, high power LED, graphic chip, laser etc. Among them liquid cooling with heat sinks containing mini/micro structures is a promising solution. During the past two decades, many efforts have been dedicated to heat transfer and flow performance of liquid cooling with micro/mini channels [1][2][3][4][5][6][7]. Comparatively, the performance of micro-pin-fins comparatively received less attention. Pin fin heatsinks have been widely used at conventional scale in industry [8][9][10][11], while limited studies at micro/mini scale have been conducted [12][13][14][15][16][17][18]. Micro pin fins own the advantages of low flow resistance and high heat transfer surface. Due to recent development of micro-fabrication technology, liquid cooling with micro-pin-fins has its potential to be a candidate for solving high heat flux problems in electronic components.Marques and Kelly [12] made use of micro circular fin pins in gas cooling heat exchanger. The pin fins were made with Nicole through LIGA process. Both the diameter and spacing are 0.5mm. Peles et al [13] constructed the correlation of thermal resistance and geometrical design, i.e. porosity and aspect ratio. The averaged heat transfer coefficient was estimated through iterative solution of fin efficiency equation. The experiments were conducted on pin fin array fabricated on silicon wafer. The circular pins were about 0.5mm in diameter and 0.25mm in height. The pressure drop of micro pin fin array was between 10kPa and 100kPa. The lowest thermal resistance reached about 0.04. The result showed that micro-pin-fin array could perform better heat transfer than rectangular micro channels. Prasher et al [14] experimentally explored heat transfer and friction factor of staggered arrays. MEMS technologies were employed on silicon wafers to form circular and square micro pin fins with porosity higher than 80%. Kosar and Peles [15,16] surveyed various staggered arrays of fins, e.g. square, circular, and

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“…In order to remove the high heat loads efficiently and improve optical performance, several liquid nitrogen (LN2) cooled silicon crystal monochromators have been applied successfully at high heat loads since the early 1990s (Lee et al, 1995;Mochizuki et al, 1995;Shastri et al, 2002;Wang et al, 2010;Stimson et al, 2019), owing to the combined advantages of high thermal conductivity and low thermal expansion coefficient at cryogenic temperatures for silicon crystal (Zhang, 1993;Lee et al, 2000Lee et al, , 2001. Subsequently, extensive research has been conducted successively on high-heat-load monochromator cooling techniques (Cao et al, 2011;Khorunzhii et al, 2003).…”

Section: Introductionmentioning

confidence: 99%

A thermal deformation optimization method for cryogenically cooled silicon crystal monochromators under high heat load

Liu,

Ji,

Fan

et al. 2024

J Synchrotron Rad

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A method to optimize the thermal deformation of an indirectly cryo-cooled silicon crystal monochromator exposed to intense X-rays at a low-emittance diffraction-limited synchrotron radiation source is presented. The thermal-induced slope error of the monochromator crystal has been studied as a function of heat transfer efficiency, crystal temperature distribution and beam footprint size. A partial cooling method is proposed, which flattens the crystal surface profile within the beam footprint by modifying the cooling contact area to optimize the crystal peak temperature. The optimal temperature varies with different photon energies, which is investigated, and a proper cooling strategy is obtained to fulfil the thermal distortion requirements over the entire photon energy range. At an absorbed power up to 300 W with a maximum power density of 44.8 W mm−2 normal incidence beam from an in-vacuum undulator, the crystal thermal distortion does not exceed 0.3 µrad at 8.33 keV. This method will provide references for the monochromator design on diffraction-limited synchrotron radiation or free-electron laser light sources.

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Modelling of a pin-fin heat converter with fluid cooling for power semiconductor modules

Cited by 11 publications

References 9 publications

The heat transfer characteristics of liquid cooling heat sink with micro pin fins

The heat transfer characteristics of liquid cooling heat sink with micro pin fins

Numerical Analysis on the Heat Transfer of Heatsink with Micro-Pin-Fins

A thermal deformation optimization method for cryogenically cooled silicon crystal monochromators under high heat load

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