2010
DOI: 10.1016/j.surfcoat.2010.05.006
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Modelling of sputtering yield amplification effect in reactive deposition of oxides

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Cited by 16 publications
(12 citation statements)
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“…This means that for large bi-layer thicknesses the doping material is sputtered away instead of being implanted to increase the erosion rate of the target material below. This fact is in agreement with the findings in [16] that the efficiency of doping in terms of the sputter yield amplification saturates upon increasing the Tungsten doping level. 2.…”
Section: Dynamics Of Reactive Serial Co-sputteringsupporting
confidence: 93%
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“…This means that for large bi-layer thicknesses the doping material is sputtered away instead of being implanted to increase the erosion rate of the target material below. This fact is in agreement with the findings in [16] that the efficiency of doping in terms of the sputter yield amplification saturates upon increasing the Tungsten doping level. 2.…”
Section: Dynamics Of Reactive Serial Co-sputteringsupporting
confidence: 93%
“…At the same time the sputter yield amplification converges as P W increases, which is demonstrated in figure 7. This is in agreement with simulations [16] which show that the Al sputter yield is maximal at about 2-3% of W in Al and decreases for larger concentrations. This is because in serial co-sputtering an increase in the W concentration correlates with an increase of the thickness of the W layer deposited each turn.…”
Section: Incorporation Of Tungsten Into the Filmssupporting
confidence: 92%
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“…Sputter yield amplification has been observed both in experiments [60,61] and MC computer simulations [59,60,62,63] of the sputtering of binary materials. The effect may be considerably stronger than the one observed by us here.…”
Section: Sputter Yield Amplificationmentioning
confidence: 96%
“…The private physical models were proposed in the last third of the 20 th century [1,2]. In addition, a large number of studies are devoted to the development of a general model, which presents the compound formation on all surfaces of a vacuum chamber as chemisorption [3][4][5][6]. A nonisothermal physicochemical model describes the process of the cold target reactive sputtering in a more consistent way [7,8].…”
Section: Introductionmentioning
confidence: 99%