Modelling of Temperature Coefficient of Resistance of a Thin Film RTD Towards Exhaust Gas Measurement Applications

Maher, Anthony; Velusamy, Vijayalakshmi; Riordan, Daniel; Walsh, Joseph T.

doi:10.21307/ijssis-2019-026

Cited by 2 publications

(2 citation statements)

References 12 publications

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“…A bar chart with the EDS mapping of the areas marked in Figure 5c, indicating phase separation in the two areas of the aged CuNi conductor, with Area 1 being Ni-rich and Area 2 being Cu-rich, further elucidating the phase separation at higher temperatures (Figure 5d). As phase separation initiates, [43] CuNW/G, [44] Ni * , [45] Ni ** , [46] Pt * , [47] Pt ** , [48] Pt/Rh, [49] ITO, [50] Au, [51] NiO x , [52] Al [53] and this work; CuNi). d) Plot depicting the data rendered in real-time from the webpage during the test, indicative of the temperature when the furnace was in the 535-570 °C range.…”

Section: Resultsmentioning

confidence: 86%

“…c) The temperature versus normalized resistance plot for establishing polynomial relation between resistance and temperature. Inset: Ashby plot comparing the maximum sensing temperature versus temperature coefficient of resistance for RTDs reported in literature and this work (Ni/Cr, [ 43 ] CuNW/G, [ 44 ] Ni * , [ 45 ] Ni ** , [ 46 ] Pt * , [ 47 ] Pt ** , [ 48 ] Pt/Rh, [ 49 ] ITO, [ 50 ] Au, [ 51 ] NiO x , [ 52 ] Al [ 53 ] and this work; CuNi). d) Plot depicting the data rendered in real‐time from the webpage during the test, indicative of the temperature when the furnace was in the 535–570 °C range.…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Khuje,

Alshatnawi,

Smilgies

et al. 2023

Adv Funct Materials

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As the modern electronic technology extends into operating in harsh working conditions, it calls for a system that is capable of uncompromising performance in extreme environments, thus providing a strong motivation to look for advanced materials and electronics with the capability of high‐throughput and rapid prototyping. Coupled with additive manufacturing, molecular decomposition metals bypass the challenging oddities of traditional material‐limited and thermally initiated metalworking, enabling high throughput and rapid prototyping of stoichiometry and composition‐controlled metals. Here, a new paradigm for the design and additive manufacturing of copper metallic alloy materials onto ceramics is described by printing molecular decomposable metal materials, capable of withstanding thermo‐mechanical loading, operating in extreme environments in static and dynamic conditions. The resulting printed hybrid electronics are electrically stable for 25 h of aging at 1000 °C. This curious fact paves a way for printed antenna and sensor electronics that reliably operate up to 1000 °C. These results can be further extended to establish other printable molecular decomposable materials as a platform for rapid prototyping of high temperature electronics that are suitable for harsh environments.

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Section: Resultsmentioning

confidence: 86%

Section: Resultsmentioning

confidence: 99%

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Khuje,

Alshatnawi,

Smilgies

et al. 2023

Adv Funct Materials

View full text Add to dashboard Cite

show abstract

Modeling, Fabrication and Testing of a Customizable Micromachined Hotplate for Sensor Applications

Tommasi

Cocuzza

Perrone

et al. 2016

Sensors

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In the sensors field the active sensing material frequently needs a controlled temperature in order to work properly. In microsystems technology, micro-machined hotplates represent a platform consisting of a thin suspended membrane where the sensing material can be deposited, usually integrating electrical stimuli and temperature readout. The micro-hotplate ensures a series of advantages such as miniaturized size, fast response, high sensitivity, low power consumption and selectivity for chemical sensing. This work compares the coplanar and the buried approach for the micro-hotplate heaters design with the aim to optimize the fabrication process and to propose a guideline for the choice of the suitable design with respect to the applications. In particular, robust Finite Element Method (FEM) models are set up in order to predict the electrical and thermal behavior of the micro-hotplates. The multiphysics approach used for the simulation allows to match as close as possible the actual device to the predictive model: geometries, materials, physics have been carefully linked to the fabricated devices to obtain the best possible accuracy. The materials involved in the fabrication process are accurately selected in order to improve the yield of the process and the performance of the devices. The fabricated micro-hotplates are able to warm the active region up to 400 °C (with a corresponding power consumption equal to 250 mW @ 400 °C) with a uniform temperature distribution in the buried micro-hotplate and a controlled temperature gradient in the coplanar one. A response time of about 70 ms was obtained on the virtual model, which perfectly agrees with the one measured on the fabricated device. Besides morphological, electrical and thermal characterizations, this work includes reliability tests in static and dynamic modes.

show abstract

Modelling of Temperature Coefficient of Resistance of a Thin Film RTD Towards Exhaust Gas Measurement Applications

Cited by 2 publications

References 12 publications

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Additive Manufacturing of High‐Temperature Hybrid Electronics via Molecular‐Decomposed Metals

Modeling, Fabrication and Testing of a Customizable Micromachined Hotplate for Sensor Applications

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