Modern Electroplating

Lowenheim, Frederick A.; Davis, J. H.

doi:10.1149/1.2402361

Cited by 83 publications

(66 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…[1][2][3] Currently, cyanide and acid-based electrolytes are predominantly used for the electrodeposition as well as solvent extraction of coppertin, since these electrolytes are possessing inherent corrosiveness and toxic effluent release which creates significant problems such as air pollution and utilization of massive amount of energy in the process. [4] These aqueous processes that are used for the electrodeposition of copper and tin additives are included with oxidation inhibitors requiring to suppress problems with hydrogen evolution and formation of metal hydroxide precipitates. [4,5] The main practical impediment for aqueous metal deposition is hydrogen evolution reactions (HERs), which creates perforation in the deposits.…”

Section: Introductionmentioning

confidence: 99%

“…[4] These aqueous processes that are used for the electrodeposition of copper and tin additives are included with oxidation inhibitors requiring to suppress problems with hydrogen evolution and formation of metal hydroxide precipitates. [4,5] The main practical impediment for aqueous metal deposition is hydrogen evolution reactions (HERs), which creates perforation in the deposits. [6] To vanquish this problem non-aqueous systems such as ionic liquid can be used.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium

Bhujbal¹,

Rout

Venkatesan

et al. 2020

ChemistrySelect

View full text Add to dashboard Cite

New protic ionic liquid, namely 1‐Methylpiperidinium trifluoromethane sulphonate [HmPip][OTf] was synthesized and employed for the dissolution of Cu and Sn metal precursors followed by the electrodeposition process of the subsequent metals. The cyclic voltammogram of [HmPip][OTf], CuCl2 (80 mM) in [HmPip][OTf] and SnCl2 (65 mM) in [HmPip][OTf] phase recorded at glassy carbon electrode (working electrode), with the glassy carbon as counter and platinum as the reference electrode. The CV indicates that Cu2+ underwent two‐step one‐electron transfer, whereas Sn2+ reduced via one step two‐electron transfer. The diffusion coefficient of Cu1+, Cu2+ and Sn2+ ions in [HmPip][OTf] phase were evaluated by the CV method. The experimental temperature and the scan rate were set at 353 K and 110 mV/s respectively. Electrodeposition of Cu and Sn was done at their corresponding reduction potential determined from cyclic voltammetry. Spectroscopic investigation of the deposits obtained after electrodeposition is done by SEM‐EDX as well as XRD.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium

Bhujbal¹,

Rout

Venkatesan

et al. 2020

ChemistrySelect

View full text Add to dashboard Cite

show abstract

“…Even in the case of solid phase bonding (e.g. hot pressing), high bonding strength was observed for copper alloys with minor additions of carbides from (Ti, Cr, B or Zr) [10,11]. Chromium or tungsten is believed to be a good promoter due to its abilities to inhibit bulk copper formation, to improve copper thermal stability and to increase copper dispersion.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy

Hamid¹,

Moustafa²,

Morsy³

et al. 2011

View full text Add to dashboard Cite

Copper composites reinforced with diamond particles were fabricated by the powder metallurgical technique. Copper matrix and diamond powders were mixed mechanically, cold com- pacted at 100 bar then sintered at 900?C. The prepared powders and sintered copper/diamond composites were investigated using X-ray diffraction (XRD) and scanning electron microscope equipped with an energy dispersive X-ray analysis (SEM/EDS). The effect of diamond contents in the Cu/diamond composite on the different properties of the composite was studied. On fracture surfaces of the Cu/uncoated diamond composites, it was found that there is a very weak bonding between diamonds and pure copper matrix. In order to improve the bonding strength between copper and the reinforcement, diamond particles were electroless coated with NiWB alloy. The results show that coated diamond particles distribute uniformly in copper composite and the interface between diamond particles and Cu matrix is clear and well bonded due to the formation of a thin layer from WB2, Ni3B, and BC2 between Cu and diamond interfaces. The properties of the composites materials using coated powder, such as hardness, transverse rupture strength, thermal conductivity, and coefficient of thermal expansion (CTE) were exhibit greater values than that of the composites using uncoated diamond powder. Additionally, the results reveals that the maximum diamond incorporation was attained at 20 Vf%. Actually, Cu/20 Vf% coated diamond com- posite yields a high thermal conductivity of 430 W/mK along with a low coefficient of thermal expansion (CTE) 6 × 10–6/K

show abstract

“…Zinc deposition has been extensively investigated under various operating conditions depending on the applications considered or the aims chosen 2. Zinc can be electrodeposited from both alkaline and acidic baths 3–8. Sulfate baths are fairly popular in the electrometallurgy of zinc even though cyanide‐containing baths are commonly used for industrial purposes 2.…”

Section: Introductionmentioning

confidence: 99%

“…Sulfate baths are fairly popular in the electrometallurgy of zinc even though cyanide‐containing baths are commonly used for industrial purposes 2. Cyanide baths have good throwing power, but their toxicity is a serious disadvantage 3…”

Section: Introductionmentioning

confidence: 99%

Improving the throwing power of acidic zinc sulfate electroplating baths

Ibrahim

2000

J. Chem. Technol. Biotechnol.

View full text Add to dashboard Cite

The effect of some plating parameters, such as Zn 2 ion concentration, pH, current density, temperature and duration on the throwing power, as well as on the throwing index of acidic zinc sulfate baths has been investigated. The addition of p-anisidine (PA) and/or sodium dodecylbenzenesulfonate (DBS) has been examined as a possible means of improving the uniformity of deposit distribution. The additives cause a substantial increase in the overpotential for the reduction of Zn 2 ions and consequently improve the throwing power of the baths. The throwing power increases by a factor of four in the presence of DBS and a factor of one-and-a-half in the presence of PA. The inhibition of zinc reduction was assumed to occur via adsorption of the PA or DBS molecules on the cathode surface and the adsorption followed the Langmuir adsorption isotherm. The surface morphology of the zinc plated with and without the additives was examined by using scanning electron microscopy (SEM).

show abstract

Modern Electroplating

Abstract: not Available.

Cited by 83 publications

References 0 publications

Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium

Electrochemical Fabrication of Copper and Tin Micro‐Crystals from a Protic Ionic Liquid Medium

Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy

Improving the throwing power of acidic zinc sulfate electroplating baths

Contact Info

Product

Resources

About