Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies

Pustan, D.; Wilde, Juergen

doi:10.1109/ectc.2008.4550034

Cited by 10 publications

(6 citation statements)

References 7 publications

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“…Experimental methods like measuring deflection of adhesively joined systems are limited to easy geometries with not more than one material with time dependent deformation mechanism. Current work with stress sensing chips evaluated during their packaging process will overcome these issues [4,5,6]…”

Section: Resultsmentioning

confidence: 99%

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

Deier

Wilde²

2009

Proceedings SENSOR 2009, Volume II

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Section: Resultsmentioning

confidence: 99%

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

Deier

Wilde²

2009

Proceedings SENSOR 2009, Volume II

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“…Electronic Speckle Pattern Interferometry (ESPI) is an approved technology for 3D-deformation measurements of electronic devices [5]. We developed a vacuum chamber with an integrated ceramic heating-stage with a minimum of induced rigid-body movement.…”

Section: Optical Deformation Measurementsmentioning

confidence: 99%

Low stress flip-chip package for pressure sensors operating at 500 °C

Zeiser

Ayub

Wagner

et al. 2015

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

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This work presents a method for a reliable assembly and interconnection of MEMS for very high temperatures. A flip-chip concept for resistive micromechanical pressure sensors with a platinum thin film was developed and sensorassemblies were fabricated. The investigated metallized ceramic substrates were AlN, Si 3 N 4 , a Low-Temperature-Cofired-Ceramic (LTCC) and a zirconia-silicate (ZrSiO 4 ). A borosilicate glass-solder was the die-attachment material and gold stud-bumps were the interconnection. The thermalmechanical stresses in the sensors, induced by the packaging process due to material-dependent mismatches were analyzed with FEM and optical deformation measurements from 20 to 500 °C. The comparison of the obtained experimental and FE-results revealed a strong influence of the applied substrate on the thermal-mechanical stresses in the chip-membrane which is affecting the output-signal and reliability. Both methods were in good accordance. The two specific silicon-matched ceramic substrates LTCC and ZrSiO 4 reduced the stresses in the sensor-element significantly. Furthermore, the electrical characterization of assembled test-sensors revealed a correlation between the package-induced stresses in the chip-membrane and the shift of the sensor-signal after the assembly-process.

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“…After the fabrication process of a micro-assembly, the surface deformation at RT was measured by white light interferometry (WLI) and the additional relative surface deformation over temperature was measured by electronic speckle pattern interferometry (ESPI). The ESPI-system setup and measurement principle were explained in [8,10]. The combination of both methods allowed calculating the curvature (inverse bending radius) of the chip surface after the die attach processes ( Figure 2).…”

Section: Stress Strain and Deformation Measurementsmentioning

confidence: 99%

“…In this work, test chips based on the piezoresistance effect in semiconductors and in metallic thin films were applied to measure absolute stresses and strains in the silicon chip surface ( Figure 1). Design, fabrication and calibration of the metallic thin film sensor were described in [8,9] and of the piezoresistive stress sensor in [10].…”

Section: Stress Strain and Deformation Measurementsmentioning

confidence: 99%

In situ analysis of the stress development during fabrication processes of micro-assemblies

Pustan

Rastiagaev

Wilde

2009

2009 59th Electronic Components and Technology Conference

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Fabrication processes, like die attachment or plastic encapsulation, lead to thermal stresses in micro-assemblies due to CTE mismatches of the involved materials. In this paper, stress-and strain-sensitive test chips were used to measure in situ absolute stresses caused by die attach and encapsulation processes. Furthermore, deformations of assemblies over temperature were observed by white light interferometry and electronic speckle pattern interferometry.Applying these methods, e.g. the effect of entrapped air in thin adhesive layers of die attach assemblies on the absolute stresses in the silicon chip surface could be observed during cure. The resulting stress offset accounted up to 68 % of the thermal stresses at RT in the assembly. IntroductionAccording to common knowledge, die attach processes of silicon chips on substrates like copper lead frames or BGA interposers lead to high tensile stresses in the chip surface and to a warping of the assembly at room temperature (RT) due to CTE mismatches of the materials [1, 2]. Further on, stress states in the chip surfaces of BGA or PTO packages typically change to high compressive stresses at RT after encapsulation [3,4]. Consequently, stress-sensitive structures like semiconductor Hall-plates in magnetic sensors cause a signal offset or change of sensitivity of the sensors due to the pseudo-Hall effect [4]. The reliability of assemblies is also affected by stress induced phenomena like die cracking, die popping or fatigue cracking in plastic encapsulants [5,6].In this paper, an experimental approach was taken to analyze the influence of glass transition temperature, curing temperature, long term storage at RT, chemical and thermal shrinkage as well as non-linear material behavior of the die attach adhesive and the influence of moisture uptake of package materials on the stress developments in microassemblies.

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Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies

Cited by 10 publications

References 7 publications

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

Low stress flip-chip package for pressure sensors operating at 500 °C

In situ analysis of the stress development during fabrication processes of micro-assemblies

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Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies

Cited by 10 publications

References 7 publications

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

P1.12 - Materials-based Modelling of Packaging Effects on the Accuracy of Micro-Sensors

Low stress flip-chip package for pressure sensors operating at 500 &#x00B0;C

In situ analysis of the stress development during fabrication processes of micro-assemblies

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Low stress flip-chip package for pressure sensors operating at 500 °C